MTFC8GAKAJCN-4M IT Micron IC FLASH 64G MMC

label:
2025/09/22 20
MTFC8GAKAJCN-4M IT Micron IC FLASH 64G MMC


CATALOG
MTFC8GAKAJCN-4M IT COUNTRY OF ORIGIN
MTFC8GAKAJCN-4M IT LIFECYCLE
MTFC8GAKAJCN-4M IT PARAMETRIC INFO
MTFC8GAKAJCN-4M IT PACKAGE INFO
MTFC8GAKAJCN-4M IT MANUFACTURING INFO
MTFC8GAKAJCN-4M IT PACKAGING INFO


COUNTRY OF ORIGIN
China
Taiwan (Province of China)
Singapore


LIFECYCLE
Obsolete
Apr 30,2022


PARAMETRIC INFO
Density (bit) 64G
Cell Type MLC NAND
Interface Type Serial e-MMC
Boot Block Yes
Timing Type Synchronous
Architecture Sectored
Programmability Yes
Typical Operating Supply Voltage (V) 3.3
MMC Version 5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 1/4/8
Number of Words 64G/16G/8G
Maximum Supply Current (mA) 50
Maximum Operating Frequency (MHz) 52
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Command Compatible Yes
ECC Support Yes
Erase Suspend/Resume Modes Support No
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Minimum Storage Temperature (°C) -40
Maximum Storage Temperature (°C) 85
Density in Bits (bit) 68719476736


PACKAGE INFO
Supplier Package VFBGA
Basic Package Type Ball Grid Array
Pin Count 153
Lead Shape Ball
PCB 153
Tab N/R
Package Length (mm) 13
Package Width (mm) 11.5
Package Height (mm) 0.64(Min)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Weight (g) N/A
Package Description Very Thin Fine Pitch Ball Grid Array
Package Family Name BGA


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray


Продукт RFQ