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• Simplifies Circuit Design
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• Reduces Board Space
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• Reduces Component Count
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• S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
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• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
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| CATALOG |
MUN5114T1G COUNTRY OF ORIGIN
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MUN5114T1G PARAMETRIC INFO
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MUN5114T1G PACKAGE INFO
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MUN5114T1G MANUFACTURING INFO
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MUN5114T1G PACKAGING INFO
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MUN5114T1G ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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China
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PARAMETRIC INFO
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| Type |
PNP |
| Configuration |
Single |
| Maximum Collector-Emitter Voltage (V) |
50 |
| Maximum Continuous DC Collector Current (A) |
0.1 |
| Maximum Power Dissipation (mW) |
310 |
| Typical Base-Emitter Resistor (KOhm) |
47 |
| Minimum DC Current Gain |
80@5mA@10V |
| Typical Input Resistance (KOhm) |
10 |
| Typical Resistor Ratio |
0.21 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2 |
| Package Width (mm) |
1.24 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2 |
| Package Overall Width (mm) |
2.1 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.35 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
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PACKAGING INFO
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| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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| ECAD MODELS |
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