 |
|
| • Ultrafast 25 and 50 Nanosecond Recovery Time |
| • 175°C Operating Junction Temperature |
| • Epoxy Meets UL 94 V−0 @ 0.125 in |
| • Low Forward Voltage |
| • Low Leakage Current |
| • Reverse Voltage to 600 V |
• ESD Ratings:
- Machine Model = C (> 400 V)
- Human Body Model = 3B (> 16,000 V) |
| • SUR8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable |
| • These Devices are Pb−Free and are RoHS Compliant* |
|
| CATALOG |
| MUR860G COUNTRY OF ORIGIN |
| MUR860G PARAMETRIC INFO |
| MUR860G PACKAGE INFO |
| MUR860G MANUFACTURING INFO |
| MUR860G PACKAGING INFO |
| MUR860G ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Philippines |
| Taiwan (Province of China) |
| United States of America |
|
| PARAMETRIC INFO |
| type |
switching diode |
| configuration |
single |
| peak reverse repetitive voltage (v) |
600 |
| maximum dc reverse voltage (v) |
600 |
| maximum continuous forward current (a) |
8 |
| speed |
ultra fast recovery rectifier |
| maximum junction ambient thermal resistance |
75°c/w |
| maximum junction case thermal resistance |
2°c/w |
| peak forward voltage (v) |
1.5 |
| peak non-repetitive surge current (a) |
100 |
| peak reverse current (ua) |
10 |
| peak reverse recovery time (ns) |
60 |
| operating junction temperature (°c) |
-65 to 175 |
| minimum storage temperature (°c) |
-65 |
| maximum storage temperature (°c) |
175 |
| minimum operating temperature (°c) |
-65 |
| maximum operating temperature (°c) |
175 |
|
| PACKAGE INFO |
| Supplier Package |
TO-220AC |
| Basic Package Type |
Through Hole |
| Pin Count |
2 |
| Lead Shape |
Through Hole |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
5.33(Max) |
| Package Length (mm) |
10.29(Max) |
| Package Width (mm) |
4.82(Max) |
| Package Height (mm) |
9.27(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.29(Max) |
| Package Overall Width (mm) |
4.82(Max) |
| Package Overall Height (mm) |
19.05(Max) |
| Seated Plane Height (mm) |
19.05(Max) |
| Mounting |
Through Hole |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Transistor Outline Package |
| Package Family Name |
TO |
| Jedec |
TO-220AC |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Standard |
N/R |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
5 to 6 |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
3 |
|
| PACKAGING INFO |
| Packaging |
Rail |
| Quantity Of Packaging |
50 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
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