MX25L25635EZNI-12G Macronix IC FLASH 256MBIT SPI 80MHZ 8WSON

label:
2025/06/19 0
MX25L25635EZNI-12G Macronix  	IC FLASH 256MBIT SPI 80MHZ 8WSON


CATALOG
MX25L25635EZNI-12G LIFECYCLE
MX25L25635EZNI-12G PARAMETRIC INFO
MX25L25635EZNI-12G PACKAGE INFO
MX25L25635EZNI-12G MANUFACTURING INFO


LIFECYCLE
Obsolete
Jul 01,2023


PARAMETRIC INFO
Density (bit) 256M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 15
Programmability Yes
Typical Operating Supply Voltage (V) 3|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 1/2/4
Number of Words 256M/128M/64M
Maximum Supply Current (mA) 45
Programming Voltage (V) 2.7 to 3.6
Maximum Operating Frequency (MHz) 80
Sector Size 4Kbyte x 8192
Program Current (mA) 25
Address Width (bit) 24
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 400/Chip
Maximum Programming Time (ms) 5/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support No
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 256byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 125
Density in Bits (bit) 268435456


PACKAGE INFO
Supplier Package WSON EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 6
Package Width (mm) 8
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 6
Package Overall Width (mm) 8
Package Overall Height (mm) 0.8(Max)
Seated Plane Height (mm) 0.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Very Thin Small Outline No Lead Package, Exposed Pad
Package Family Name SON
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30 to 40
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) N/A
Under Plating Material N/A
Terminal Base Material N/A


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