N25Q128A13ESE40G Micron IC FLASH 128M SPI 108MHZ 8SOP2

label:

2024/03/15 317

• SPI-compatible serial bus interface

• 108 MHz (MAX) clock frequency

• 2.7–3.6V single supply voltage

• Dual/quad I/O instruction provides increasedthroughput up to 432 MHz

• Supported protocols
– Extended SPI, dual I/O, and quad I/O

• Execute-in-place (XIP) mode for all three protocols
– Configurable via volatile or nonvolatile registers
– Enables memory to work in XIP mode directly after power-on

• PROGRAM/ERASE SUSPEND operations

• Continuous read of entire memory via a single command
– Fast read
– Quad or dual output fast read
– Quad or dual I/O fast read

• Flexible to fit application
– Configurable number of dummy cycles
– Output buffer configurable

• Software reset

• 64-byte, user-lockable, one-time programmable(OTP) dedicated area

• Erase capability
– Subsector erase 4KB uniform granularity blocks
– Sector erase 64KB uniform granularity blocks
– Full-chip erase

• Write protection
– Software write protection applicable to every64KB sector via volatile lock bit
– Hardware write protection: protected area sizedefined by five nonvolatile bits (BP0, BP1, BP2,BP3, and TB)
– Additional smart protections, available upon request

• Electronic signature
– JEDEC-standard 2-byte signature (BA18h)
– Unique ID code (UID): 17 read-only bytes, including:
• Two additional extended device ID (EDID)bytes to identify device factory options
• Customized factory data (14 bytes)

• Minimum 100,000 ERASE cycles per sector

• More than 20 years data retention

• Packages JEDEC standard, all RoHS compliant
– F7 = V-PDFN-8 6mm x 5mm Sawn (MLP8 6mm x5mm)
– F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)
– 12 = T-PBGA-24b05 6mm x 8mm
– 14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array
– SF = SOP2-16 300 mils body width (SO16W)
– SE = SOP2-8 208 mils body width (SO8W)

CATALOG

N25Q128A13ESE40G COUNTRY OF ORIGIN

N25Q128A13ESE40G LIFECYCLE

N25Q128A13ESE40G PARAMETRIC INFO

N25Q128A13ESE40G PACKAGE INFO

N25Q128A13ESE40G MANUFACTURING INFO

N25Q128A13ESE40G PACKAGING INFO

N25Q128A13ESE40G ECAD MODELS

COUNTRY OF ORIGIN

China

LIFECYCLE

Obsolete
Dec 05,2017

PARAMETRIC INFO

Density (bit)	128M
Cell Type	NOR
Interface Type	Serial (SPI, Dual SPI, Quad SPI)
Block Organization	Symmetrical
Boot Block	Yes
Timing Type	Synchronous
Architecture	Sectored
Maximum Access Time (ns)	7
Typical Operating Supply Voltage (V)	3\|3.3
Programmability	Yes
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Number of Bits per Word (bit)	1/2/4
Number of Words	128M/64M/32M
Location of Boot Block	Bottom\|Top
Maximum Operating Current (mA)	20
Programming Voltage (V)	2.7 to 3.6\|8.5 to 9.5
Maximum Operating Frequency (MHz)	108
Sector Size	4Kbyte x 4096
Program Current (mA)	20
Address Bus Width (bit)	24
Minimum Operating Supply Voltage (V)	2.7
Maximum Operating Supply Voltage (V)	3.6
Maximum Erase Time (s)	250/Chip
Maximum Programming Time (ms)	5/Page
Command Compatible	Yes
ECC Support	No
Erase Suspend/Resume Modes Support	Yes
Simultaneous Read/Write Support	No
Support of Common Flash Interface	No
Support of Page Mode	No
Page Size	256byte
Minimum Endurance (Cycles)	100000
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Density in Bits (bit)	134217728
Process Technology	65nm

PACKAGE INFO

Supplier Package	SOIC W
Basic Package Type	Lead-Frame SMT
Pin Count	8
Lead Shape	Gull-wing
PCB	8
Tab	N/R
Pin Pitch (mm)	1.27
Package Length (mm)	5.49(Max)
Package Width (mm)	5.49(Max)
Package Height (mm)	1.91(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	2.16(Max)
Mounting	Surface Mount
Package Material	Plastic
Package Description	Small Outline Package (Type II)
Package Family Name	SO
Jedec	N/A

MANUFACTURING INFO

MSL	N/A
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	20 to 40
Number of Reflow Cycle	3
Standard	J-STD-020C
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	N/A
Under Plating Material	N/A
Terminal Base Material	N/A

PACKAGING INFO

Packaging Suffi	G
Packaging	Tube

ECAD MODELS