 |
|
| • Ultra−High Speed: tPD = 2.7 ns (Typical) into 50 pF at 5 V VCC |
| • High Output Drive: ±24 mA at 3 V VCC |
| • Broad VCC Operating Range: 1.65 V to 5.5 V |
| • Matches Performance of LCX Operated at 3.3 V VCC |
| • Power Down High Impedance Inputs / Outputs |
| • Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation |
| • Proprietary Noise / EMI Reduction Circuitry |
| • Ultra−Small MicroPak™ Packages |
| • Space−Saving SOT23−5, SC−74A and SC−88A Packages |
| • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant |
|
| CATALOG |
| NC7SZ08P5X COUNTRY OF ORIGIN |
| NC7SZ08P5X PARAMETRIC INFO |
| NC7SZ08P5X PACKAGE INFO |
| NC7SZ08P5X MANUFACTURING INFO |
| NC7SZ08P5X PACKAGING INFO |
| NC7SZ08P5X ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Philippines |
| Thailand |
| United States of America |
|
| PARAMETRIC INFO |
| Logic Function |
AND |
| Number of Element Inputs |
2-IN |
| Number of Element Outputs |
1 |
| Number of Elements per Chip |
1 |
| Number of Output Enables per Element |
0 |
| Number of Selection Inputs per Element |
0 |
| Process Technology |
CMOS |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Maximum High Level Output Current (mA) |
-32 |
| Maximum Low Level Output Current (mA) |
32 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
5.2@3.3V|4.5@5V |
| Absolute Propagation Delay Time (ns) |
12.7 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum Quiescent Current (uA) |
2 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SC-88A |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.2(Max) |
| Package Width (mm) |
1.35(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
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