NCP1521BSNT1G onsemi IC REG BUCK ADJ 0.6A SYNC 5TSOP

label:
2024/01/22 325



• Up to 96% Efficiency
• Best−In−Class Ripple, including PFM Mode
• Sources up to 600 mA
• 1.5 MHz Switching Frequency
• Adjustable Output Voltage from 0.9 V to 3.9 V
• Synchronous Rectification for Higher Efficiency
• 2.7 V to 5.5 V Input Voltage Range
• Low Quiescent Current
• Shutdown Current Consumption of 0.3 A
• Thermal Limit Protection
• Short Circuit Protection
• All Pins are Fully ESD Protected
• This is a Pb−Free Device


CATALOG
NCP1521BSNT1G COUNTRY OF ORIGIN
NCP1521BSNT1G PARAMETRIC INFO
NCP1521BSNT1G PACKAGE INFO
NCP1521BSNT1G MANUFACTURING INFO
NCP1521BSNT1G PACKAGING INFO
NCP1521BSNT1G ECAD MODELS
NCP1521BSNT1G APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Type Synchronous Step Down
Number of Outputs 1
Minimum Input Voltage (V) 2.7
Maximum Input Voltage (V) 5.5
Output Voltage (V) 0.9 to 3.9
Maximum Output Current (A) 0.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Switching Frequency (kHz) 1500(Typ)
Efficiency (%) 96
Switching Regulator Yes
Operating Supply Voltage (V) 2.7 to 5.5
Output Type Adjustable
Load Regulation 0.0005%/mA(Typ)
Line Regulation 0.05%(Typ)
Typical Quiescent Current (uA) 30
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package TSOP
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.15(Max)
Package Width (mm) 1.65(Max)
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Package
Package Family Name SO
Jedec N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeZnPAg


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000


ECAD MODELS



APPLICATIONS
• Cellular Phones, Smart Phones and PDAs
• Digital Still/Video Cameras
• MP3 Players and Portable Audio Systems
• Wireless and DSL Modems
• Portable Equipment
• USB Powered Devices
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