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• Up to 96% Efficiency
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• Best−In−Class Ripple, including PFM Mode
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• Sources up to 600 mA
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• 1.5 MHz Switching Frequency |
• Adjustable Output Voltage from 0.9 V to 3.9 V |
• Synchronous Rectification for Higher Efficiency |
• 2.7 V to 5.5 V Input Voltage Range
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• Low Quiescent Current |
• Shutdown Current Consumption of 0.3 A |
• Thermal Limit Protection |
• Short Circuit Protection |
• All Pins are Fully ESD Protected |
• This is a Pb−Free Device |
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CATALOG |
NCP1521BSNT1G COUNTRY OF ORIGIN |
NCP1521BSNT1G PARAMETRIC INFO
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NCP1521BSNT1G PACKAGE INFO
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NCP1521BSNT1G MANUFACTURING INFO
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NCP1521BSNT1G PACKAGING INFO
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NCP1521BSNT1G ECAD MODELS
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NCP1521BSNT1G APPLICATIONS
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COUNTRY OF ORIGIN |
Malaysia |
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PARAMETRIC INFO
|
Type |
Synchronous Step Down |
Number of Outputs |
1 |
Minimum Input Voltage (V) |
2.7 |
Maximum Input Voltage (V) |
5.5 |
Output Voltage (V) |
0.9 to 3.9 |
Maximum Output Current (A) |
0.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Switching Frequency (kHz) |
1500(Typ) |
Efficiency (%) |
96 |
Switching Regulator |
Yes |
Operating Supply Voltage (V) |
2.7 to 5.5 |
Output Type |
Adjustable |
Load Regulation |
0.0005%/mA(Typ) |
Line Regulation |
0.05%(Typ) |
Typical Quiescent Current (uA) |
30 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
TSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
5 |
Lead Shape |
Gull-wing |
PCB |
5 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
3.15(Max) |
Package Width (mm) |
1.65(Max) |
Package Height (mm) |
1(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Small Outline Package |
Package Family Name |
SO |
Jedec |
N/A |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
CuFeZnPAg |
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PACKAGING INFO
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Packaging Suffix |
T1 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
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ECAD MODELS
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APPLICATIONS
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• Cellular Phones, Smart Phones and PDAs
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• Digital Still/Video Cameras
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• MP3 Players and Portable Audio Systems |
• Wireless and DSL Modems |
• Portable Equipment |
• USB Powered Devices
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