|
|
• Quiescent Current of 0.5 A Typical
|
• High Accuracy Undervoltage Threshold of 2.0%
|
• Externally Programmable Time Delay Generator
|
• Wide Operating Voltage Range of 0.8 V to 10 V
|
• Complementary or Open Drain Output
|
• Active Low or Active High Reset
|
|
| CATALOG |
NCP302LSN27T1G COUNTRY OF ORIGIN
|
NCP302LSN27T1G LIFECYCLE
|
NCP302LSN27T1G PARAMETRIC INFO
|
NCP302LSN27T1G PACKAGE INFO
|
NCP302LSN27T1G MANUFACTURING INFO
|
NCP302LSN27T1G PACKAGING INFO
|
NCP302LSN27T1G ECAD MODELS
|
|
NCP302LSN27T1G
APPLICATIONS |
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
LIFECYCLE
|
Obsolete
Apr 01,2022
|
|
PARAMETRIC INFO
|
| Output Driver |
Active Low/CMOS |
| Manual Reset |
No |
| Watchdog Timer |
No |
| Number of Supervisors |
1 |
| Typical Reset Threshold Voltage (V) |
2.7 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Chip Enable Signals |
No |
| Power Fail Detection |
Yes |
| Battery Backup Switching |
Yes |
| Maximum Operating Supply Voltage (V) |
10 |
| Minimum Reset Threshold Voltage (V) |
2.646 |
| Process Technology |
CMOS |
| Maximum Reset Threshold Voltage (V) |
2.754 |
| Maximum Supply Current (uA) |
1.3 |
| Minimum Operating Supply Voltage (V) |
0.8 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Type |
Voltage Detector |
| Programmability |
Yes |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3 |
| Package Width (mm) |
1.5 |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
2.75 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1 |
| Minimum PACKAGE_DIMENSION_H |
0.89 |
| Maximum PACKAGE_DIMENSION_L |
3.15 |
| Minimum PACKAGE_DIMENSION_L |
2.85 |
| Maximum PACKAGE_DIMENSION_W |
1.65 |
| Minimum PACKAGE_DIMENSION_W |
1.35 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
0.9 |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
CuFeZnPAg |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Microprocessor Reset Controller |
| • Low Battery Detection |
| • Power Fail Indicator |
| • Battery Backup Detection |
| |
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