NCP3170ADR2G onsemi IC REG BUCK ADJ 3A SYNC 8SOIC

label:
2025/02/19 70
NCP3170ADR2G onsemi  IC REG BUCK ADJ 3A SYNC 8SOIC


CATALOG
NCP3170ADR2G COUNTRY OF ORIGIN
NCP3170ADR2G PARAMETRIC INFO
NCP3170ADR2G PACKAGE INFO
NCP3170ADR2G MANUFACTURING INFO
NCP3170ADR2G PACKAGING INFO
NCP3170ADR2G ECAD MODELS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Type Step Down
Number of Outputs 1
Minimum Input Voltage (V) 4.5
Maximum Input Voltage (V) 18
Output Voltage (V) 0.8(Min)
Maximum Output Current (A) 3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Switching Frequency (kHz) 550
Switching Regulator Yes
Operating Supply Voltage (V) 4.5 to 18
Output Type Adjustable
Line Regulation 1%(Typ)
Typical Quiescent Current (uA) 1700
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Typical Switch Current (A) 6(Max)


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 5 to 6
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeAgZn
Number of Wave Cycles 2


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2500
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ