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| CATALOG |
NCP3335AMNADJR2G COUNTRY OF ORIGIN
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NCP3335AMNADJR2G PARAMETRIC INFO
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NCP3335AMNADJR2G PACKAGE INFO
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NCP3335AMNADJR2G MANUFACTURING INFO
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NCP3335AMNADJR2G PACKAGING INFO
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NCP3335AMNADJR2G ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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Czechia
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PARAMETRIC INFO
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| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.5(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Output Type |
Adjustable |
| Output Voltage Range (V) |
<1.8|1.8 to 10|10 to 20 |
| Junction to Ambient |
215°C/W(Typ) |
| Polarity |
Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection |
| Load Regulation |
0.04mV/mA(Typ) |
| Line Regulation |
0.04mV/V(Typ) |
| Maximum Dropout Voltage @ Current (V) |
0.34@500mA|0.23@300mA|0.11@50mA|0.01@100uA |
| Minimum Input Voltage (V) |
2.6 |
| Maximum Input Voltage (V) |
12 |
| Output Voltage (V) |
1.25 to 10 |
| Reference Voltage (V) |
1.261 |
| Accuracy (%) |
±0.9 |
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PACKAGE INFO
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| Supplier Package |
DFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
No Lead |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Jedec |
MO-229 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R2 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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