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| • Programmable Output Voltage to 36 V |
• Low Minimum Operating Current: 40 A, Typ @ 25°C
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• Voltage Reference Tolerance: ±0.5%, Typ @ 25°C (NCP431B/NCP432B)
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• Low Dynamic Output Impedance, 0.22 Typical
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• Sink Current Capability of 40 A to 100 mA
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• Equivalent Full−Range Temperature Coefficient of 50 ppm/°C Typical
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• Temperature Compensated for Operation over Full Rated Operating Temperature Range
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• SC Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
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• These are Pb−Free Devices
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| CATALOG |
NCP432BVSNT1G COUNTRY OF ORIGIN
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NCP432BVSNT1G PARAMETRIC INFO
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NCP432BVSNT1G PACKAGE INFO
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NCP432BVSNT1G MANUFACTURING INFO
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NCP432BVSNT1G PACKAGING INFO
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NCP432BVSNT1G ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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| Topology |
Shunt |
| Reference Type |
Adjustable |
| Output Voltage (V) |
2.5 to 36 |
| Initial Accuracy |
0.5% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Input Voltage (V) |
37 |
| Maximum Output Current (mA) |
100 |
| Maximum Temperature Coefficient |
50ppm/°C(Typ) |
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PACKAGE INFO
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| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.3 |
| Package Height (mm) |
0.94 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.4 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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