NCV7356D1R2G onsemi IC TXRX CAN HALF DUP 8SOIC

label:
2024/04/17 256

• Fully Compatible with J2411 Single Wire CAN Specification
• 60 A (max) Sleep Mode Current
• Operating Voltage Range 5.0 to 27 V
• Up to 100 kbps High−Speed Transmission Mode
• Up to 40 kbps Bus Speed
• Selective BUS Wake−Up
• Logic Inputs Compatible with 3.3 V and 5 V Supply Systems
• Control Pin for External Voltage Regulators (14 Pin Package Only)
• Standby to Sleep Mode Timeout
• Low RFI Due to Output Wave Shaping
• Fully Integrated Receiver Filter
• Bus Terminals Short−Circuit and Transient Proof
• Loss of Ground Protection
• Protection Against Load Dump, Jump Start
• Thermal Overload and Short Circuit Protection
• ESD Protection of 4.0 kV on CANH Pin (2.0 kV on Any Other Pin)
• Undervoltage Lock Out
• Bus Dominant Timeout Feature
• Internally Fused Leads in SO−14 Package
• NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
CATALOG
NCV7356D1R2G COUNTRY OF ORIGIN
NCV7356D1R2G PARAMETRIC INFO
NCV7356D1R2G PACKAGE INFO
NCV7356D1R2G MANUFACTURING INFO
NCV7356D1R2G PACKAGING INFO
NCV7356D1R2G EACD MODELS



COUNTRY OF ORIGIN
Philippines



PARAMETRIC INFO
Category Transceiver
Maximum Data Rate 100Kbps
Standard Supported CAN 2.0
Number of Transceivers 1
Power Down Mode Shutdown|Sleep|Standby
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive
Typical Operating Supply Voltage (V) 9|12|15|18|24
Minimum Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 27



PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 5 to 6
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeAgZn
Number of Wave Cycles N/A



PACKAGING INFO
Packaging Suffix R2
Packaging Tape and Reel
Quantity Of Packaging 2500
Packaging Document Link to Datasheet



ECAD MODELS

Продукт RFQ