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• Short−Circuit Protection
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• Thermal Shutdown with Automatic Restart
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• Overvoltage Protection
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| • Integrated Clamp for Inductive Switching |
| • ESD Protection |
| • dV/dt Robustness |
| • Analog Drive Capability (Logic Level Input) |
| • NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable |
| • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant |
| |
| CATALOG |
| NCV8402ADDR2G COUNTRY OF ORIGIN |
NCV8402ADDR2G PARAMETRIC INFO
|
NCV8402ADDR2G PACKAGE INFO
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NCV8402ADDR2G MANUFACTURING INFO
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NCV8402ADDR2G PACKAGING INFO
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NCV8402ADDR2G EACD MODELS
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| NCV8402ADDR2G APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
|
PARAMETRIC INFO
|
| Type |
Low Side |
| Number of Outputs |
2 |
| Number of Inputs |
2 |
| Current Limit |
4.8 |
| Fault Protection |
Short Circuit Protection|Over Voltage Protection |
| Number of Switches |
2 |
| Maximum Output Current (A) |
2 |
| Output Type |
N-Channel |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Switch On Resistance (mOhm) |
195 |
| Maximum Power Dissipation (mW) |
1620 |
| Supplier Temperature Grade |
Automotive |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
| |
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
5 to 6 |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
2 |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R2 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4(Min) |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
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ECAD MODELS
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| APPLICATIONS |
| • Switch a Variety of Resistive, Inductive and Capacitive Loads |
| • Can Replace Electromechanical Relays and Discrete Circuits |
| • Automotive / Industrial |
| |
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