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• Short Circuit Protection |
• Thermal Shutdown with Automatic Restart |
• Over Voltage Protection |
• Integrated Clamp for Inductive Switching |
• ESD Protection |
• dV/dt Robustness |
• Analog Drive Capability (Logic Level Input) |
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable |
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant |
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CATALOG |
NCV8403ASTT1G COUNTRY OF ORIGIN |
NCV8403ASTT1G PARAMETRIC INFO |
NCV8403ASTT1G PACKAGE INFO |
NCV8403ASTT1G MANUFACTURING INFO |
NCV8403ASTT1G PACKAGING INFO |
NCV8403ASTT1G ECAD MODELS |
NCV8403ASTT1G APPLICATIONS |
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COUNTRY OF ORIGIN |
Israel |
Malaysia |
|
PARAMETRIC INFO |
Number of Outputs |
1 |
Number of Inputs |
1 |
Maximum Output Current (A) |
22 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Switch On Resistance (mOhm) |
105 |
Maximum Power Dissipation (mW) |
2500 |
Process Technology |
TMOS STD |
Supplier Temperature Grade |
Automotive |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO |
Supplier Package |
SOT-223 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
4 |
Lead Shape |
Gull-wing |
PCB |
3 |
Tab |
Tab |
Pin Pitch (mm) |
2.3 |
Package Length (mm) |
6.5 |
Package Width (mm) |
3.5 |
Package Height (mm) |
1.57 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
6.5 |
Package Overall Width (mm) |
7 |
Package Overall Height (mm) |
1.63 |
Seated Plane Height (mm) |
1.63 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
TO-261AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
T1 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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APPLICATIONS |
• Switch a Variety of Resistive, Inductive and Capacitive Loads |
• Can Replace Electromechanical Relays and Discrete Circuits |
• Automotive / Industrial |
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