NDT2955 onsemi / Fairchild MOSFET P-CH 60V 2.5A SOT-223-4

label:
2024/03/22 253



• −2.5 A, −60 V♦ RDS(ON) = 300 m @ VGS = −10 V♦ RDS(ON) = 500 m @ VGS = −4.5 V
• High Density Cell Design for Extremely Low RDS(ON).
• High Power and Current Handling Capability in a Widely Used Surface Mount Package
• This is a Pb−Free Device


CATALOG
NDT2955 COUNTRY OF ORIGIN
NDT2955 PARAMETRIC INFO
NDT2955 PACKAGE INFO
NDT2955 MANUFACTURING INFO
NDT2955 PACKAGING INFO
NDT2955 EACD MODELS
NDT2955 APPLICATIONS


COUNTRY OF ORIGIN
China
Philippines
Malaysia
Korea (Republic of)


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single Dual Drain
Maximum Drain Source Voltage (V) 60
Maximum Continuous Drain Current (A) 2.5
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 300@10V
Typical Gate Charge @ Vgs (nC) 11@10V
Typical Gate Charge @ 10V (nC) 11
Maximum Power Dissipation (mW) 3000
Process Technology TMOS
Category Power MOSFET
Typical Input Capacity @ Vds (pF) 601@30V
Typical Turn-On Delay Time (ns) 12
Typical Turn-Off Delay Time (ns) 19
Typical Fall Time (ns) 6
Typical Rise Time (ns) 10
Number of Elements per Chip 1
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier packaging SOT-223
Basic package type Lead-Frame SMT
Number of pins 4
Pin shape Gull-wing
PCB 3
ears ears
Pin spacing (mm) 2.3
Package length (mm) 6.5
Package width (mm) 3.5
Package height (mm) 1.69(Max)
Package diameter (mm) N/R
Mounting surface height (mm) 1.8(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Small Outline Transistor
Package series name SOT
JEDEC TO-261AA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard not applicable
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material CuFePZnAg


PACKAGING INFO
Package Tape and reel packaging
Packing quantity 4000
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• DC/DC Converter
• Power Management
Продукт RFQ