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• Timing From Microseconds to Hours
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• Astable or Monostable Operation
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• Adjustable Duty Cycle
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| • TTL-Compatible Output Can Sink or Source Up to 200 mA
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| • On Products Compliant to MIL-PRF-38535,All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters. |
|
| CATALOG |
| NE555P COUNTRY OF ORIGIN |
NE555P PARAMETRIC INFO
|
NE555P PACKAGE INFO
|
NE555P MANUFACTURING INFO
|
NE555P PACKAGING INFO
|
NE555P ECAD MODELS
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NE555P APPLICATIONS
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|
| COUNTRY OF ORIGIN |
| China |
| Mexico |
| Thailand |
| Malaysia |
|
PARAMETRIC INFO
|
| Type |
Standard |
| Number of Internal Timers |
1 |
| Maximum High Level Output Current (mA) |
-200 |
| Maximum Low Level Output Current (mA) |
200 |
| Output Logic Level |
TTL |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5|9|12|15 |
| Maximum Operating Supply Voltage (V) |
16 |
| Maximum Quiescent Current (mA) |
15 |
|
|
PACKAGE INFO
|
| Supplier Package |
PDIP |
| Basic Package Type |
Through Hole |
| Pin Count |
8 |
| Lead Shape |
Through Hole |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
10.16(Max) |
| Package Width (mm) |
6.6(Max) |
| Package Height (mm) |
5.08(Max) - 0.51(Min) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.16(Max) |
| Package Overall Width (mm) |
10.92(Max) |
| Package Overall Height (mm) |
5.08(Max) |
| Seated Plane Height (mm) |
5.08(Max) |
| Mounting |
Through Hole |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Jedec |
MS-001BA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Standard |
N/R |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
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APPLICATIONS
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• Fingerprint Biometrics
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• Iris Biometrics
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• RFID Reader
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| |
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