|
|
• Ideal for Coil−on−Plug and Driver−on−Coil Applications
|
• DPAK Package Offers Smaller Footprint for Increased
Board Space
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• Gate−Emitter ESD Protection
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• Temperature Compensated Gate−Collector Voltage Clamp
Limits Stress Applied to Load
|
• Integrated ESD Diode Protection
|
• New Design Increases Unclamped Inductive Switching
(UIS) Energy Per Area
|
• Low Threshold Voltage for Interfacing Power Loads to
Logic or Microprocessor Devices
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|
| CATALOG |
| NGD8201ANT4G COUNTRY OF ORIGIN |
NGD8201ANT4G LIFECYCLE
|
NGD8201ANT4G PARAMETRIC INFO
|
NGD8201ANT4G PACKAGE INFO
|
NGD8201ANT4G PACKAGING INFO
|
NGD8201ANT4G FUNCTIONAL DIAGRAM
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COUNTRY OF ORIGIN
|
| China |
Malaysia
|
Mexico
|
|
LIFECYCLE
|
Obsolete
Aug 28,2020
|
|
PARAMETRIC INFO
|
| Channel Type |
N |
| Configuration |
Single |
| Maximum Collector-Emitter Voltage (V) |
440 |
| Maximum Continuous Collector Current (A) |
20 |
| Maximum Power Dissipation (W) |
125 |
| Maximum Gate Emitter Voltage (V) |
±15 |
| Maximum Gate Emitter Leakage Current (uA) |
350 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
|
|
PACKAGE INFO
|
| Supplier Package |
DPAK |
| Pin Count |
3 |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.29 |
| Package Length (mm) |
6.73(Max) |
| Package Width (mm) |
6.22(Max) |
| Package Height (mm) |
2.38(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Deca Watt Package |
| Package Family Name |
TO-252 |
| Jedec |
TO-252 |
|
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PACKAGING INFO
|
| Packaging Suffix |
T4 |
| Packaging |
Tape and Reel |
|
|
FUNCTIONAL DIAGRAM
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