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• High DC Current Gain
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• Low Collector−Emitter Saturation Voltage
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• High Current−Gain − Bandwidth Product
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• Epoxy Meets UL 94 V−0 @ 0.125 in
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• NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
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• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
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| CATALOG |
NJVNJD2873T4G COUNTRY OF ORIGIN
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NJVNJD2873T4G PARAMETRIC INFO
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NJVNJD2873T4G PACKAGE INFO
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NJVNJD2873T4G MANUFACTURING INFO
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NJVNJD2873T4G PACKAGING INFO
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COUNTRY OF ORIGIN
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Malaysia
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Viet Nam
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PARAMETRIC INFO
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| Type |
NPN |
| Configuration |
Single |
| Maximum Collector-Emitter Voltage (V) |
50 |
| Maximum Collector Base Voltage (V) |
50 |
| Maximum Emitter Base Voltage (V) |
5 |
| Maximum DC Collector Current (A) |
2 |
| Minimum Transition Frequency (MHz) |
65 |
| Material |
Si |
| Maximum Power Dissipation (mW) |
1680 |
| Operating Junction Temperature (°C) |
-65 to 175 |
| Maximum Collector Cut-Off Current (nA) |
100 |
| Maximum Collector-Emitter Saturation Voltage (V) |
0.3@0.05mA@1mA |
| Maximum Base Emitter Saturation Voltage (V) |
1.2@0.05A@1A |
| Category |
Bipolar Power |
| Minimum DC Current Gain |
120@0.5A@2V|40@2A@2V |
| Number of Elements per Chip |
1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
175 |
| Supplier Temperature Grade |
Automotive |
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PACKAGE INFO
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| Supplier Package |
DPAK |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.29 |
| Package Length (mm) |
6.73(Max) |
| Package Width (mm) |
6.22(Max) |
| Package Height (mm) |
2.38(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.73(Max) |
| Package Overall Width (mm) |
10.41(Max) |
| Package Overall Height (mm) |
2.51(Max) |
| Seated Plane Height (mm) |
2.51(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Deca Watt Package |
| Package Family Name |
TO-252 |
| Jedec |
TO-252AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
T4 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
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