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• Designed for 1.65 V to 5.5 V VCC Operation
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• 3.7 ns tPD at VCC = 5 V (typ)
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• Input/Output Overvoltage Tolerant up to 5.5 V
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| • IOFF Supports Partial Power Down Protection |
| • Source/Sink 24 mA at 3.0 V |
| • Available in SC−88A, SC−74A, SOT−553, SOT−953 and UDFN6 Packages |
| • Chip Complexity < 100 FETs |
| • −Q Suffix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable |
| • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant |
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| CATALOG |
| NL17SZ17DFT2G COUNTRY OF ORIGIN |
NL17SZ17DFT2G PARAMETRIC INFO
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NL17SZ17DFT2G PACKAGE INFO
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NL17SZ17DFT2G MANUFACTURING INFO
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NL17SZ17DFT2G PACKAGING INFO
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NL17SZ17DFT2G EACD MODELS
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| COUNTRY OF ORIGIN |
| Malaysia |
| China |
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PARAMETRIC INFO
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| Process Technology |
CMOS |
| Logic Family |
LCX |
| Logic Function |
Schmitt Trigger Buffer |
| Input Signal Type |
Single-Ended |
| Polarity |
Non-Inverting |
| Tolerant I/Os (V) |
5.5 |
| Bus Hold |
No |
| Number of Elements per Chip |
1 |
| Number of Channels per Chip |
1 |
| Number of Output Enables per Chip |
0 |
| Number of Input Enables per Chip |
0 |
| Number of Inputs per Chip |
1 |
| Number of Outputs per Chip |
1 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Power Dissipation (mW) |
332 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
7.2@3V to 3.6V|5.9@4.5V to 5.5V |
| Absolute Propagation Delay Time (ns) |
15.6 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-32 |
| Maximum Low Level Output Current (mA) |
32 |
| Maximum Quiescent Current (uA) |
1 |
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PACKAGE INFO
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| Supplier Package |
SC-88A |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.2(Max) |
| Package Width (mm) |
1.35(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.2(Max) |
| Package Overall Width (mm) |
2.2(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T2 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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