NLAS3899BMNTXG onsemi IC SWITCH DUAL DPDT 16QFN

label:
2024/06/28 228


CATALOG
NLAS3899BMNTXG COUNTRY OF ORIGIN
NLAS3899BMNTXG LIFECYCLE
NLAS3899BMNTXG PARAMETRIC INFO
NLAS3899BMNTXG PACKAGE INFO
NLAS3899BMNTXG MANUFACTURING INFO
NLAS3899BMNTXG PACKAGING INFO
NLAS3899BMNTXG EACD MODELS



COUNTRY OF ORIGIN
Malaysia
Thailand



LIFECYCLE
Obsolete
Dec 15,2023
PARAMETRIC INFO
Type Analog Switch
Number of Channels per Chip 2
Switch Architecture DPDT
Polarity Non-Inverting
Maximum On Resistance Range (Ohm) 1 to 5
Configuration Dual DPDT
Number of Inputs per Chip 4
Function General
Latch-Up Proof No
Typical Switch On Capacitance (pF) 20
Typical Switch Off Capacitance (pF) 10
Typical Off Leakage Current (nA) ±10
Typical Off Isolation (dB) -67
Typical Crosstalk (dB) -100
Maximum On Resistance Match Between Switches (Ohm) 0.8(Typ)
Maximum On Resistance Flatness (Ohm) 1.1(Typ)
Typical Charge Injection (pC) 111
Number of Outputs per Chip 8
Chip Enable Signals Yes
Maximum On Resistance (Ohm) 4@2.5V
Maximum Turn-On Time (ns) 30(Typ)@4.3V
Maximum Turn-Off Time (ns) 20(Typ)@4.53V
Input Signal Type Single
Output Signal Type Single
Maximum Low Level Output Current (mA) 300
Maximum High Level Output Current (mA) 300
Maximum Frequency (25°C) @ Vcc (MHz) 280(Typ)@4.3V
Special Features Break-Before-Make
Switch Control Logic Active Low/High
Switch Normal Position NO/NC
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single
Minimum Single Supply Voltage (V) 1.65
Typical Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 4.3



PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 16
Lead Shape No Lead
PCB 16
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 3
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Jedec MO-220VEED-6
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 13
Reel Width (mm) 12.4(Min)
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Type Embossed
Продукт RFQ