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CATALOG
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NLC453232T-3R3K-PF COUNTRY OF ORIGIN
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NLC453232T-3R3K-PF LIFECYCLE
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NLC453232T-3R3K-PF PARAMETRIC INFO
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NLC453232T-3R3K-PF PACKAGE INFO
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| NLC453232T-3R3K-PF MANUFACTURING INFO |
NLC453232T-3R3K-PF PACKAGING INFO
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NLC453232T-3R3K-PF ECAD MODELS
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COUNTRY OF ORIGIN
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Japan
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United States of America
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LIFECYCLE
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Obsolete
Mar 31,2022
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PARAMETRIC INFO
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| Type |
General Purpose Chip |
| Technology |
Wirewound |
| Protection Style |
Molded/Unshielded |
| Core Material |
Ferrite |
| Inductance (H) |
3.3u |
| Tolerance |
10% |
| Inductance Test Frequency (Hz) |
7.96M |
| Maximum DC Current (A) |
0.75 |
| Typical Temperature Rise (°C) |
20 |
| Maximum Saturation Current (A) |
0.75 |
| Maximum DC Resistance (Ohm) |
0.22 |
| Minimum Quality Factor |
10 |
| Quality Test Frequency (Hz) |
7.96M |
| Minimum Self Resonant Frequency (Hz) |
45M |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Operating Temperature (°C) |
-40 |
| Operating Temperature (°C) |
-40 to 105 |
| Polarity |
No |
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PACKAGE INFO
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| Case Size |
1812 |
| Product Length (mm) |
4.8 |
| Product Depth (mm) |
3.4 |
| Product Height (mm) |
3.4 |
| Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.18 |
| Mounting |
Surface Mount |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
255 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
SnCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
2 |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Blister |
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ECAD MODELS
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