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• Wide supply range 2.3 V to 5.5 V
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• Low RDSon
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• Eight Power EDNMOS transistor outputs of 100 mA continuous current
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• 250 mA current limit capability
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• Output clamping voltage 33 V
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• 30 mJ avalanche energy capability
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• Enhanced cascading for multiple stages
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• All registers cleared with single input
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| CATALOG |
NPIC6C596APW-Q100J LIFECYCLE
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NPIC6C596APW-Q100J PARAMETRIC INFO
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NPIC6C596APW-Q100J PACKAGE INFO
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NPIC6C596APW-Q100J MANUFACTURING INFO
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NPIC6C596APW-Q100J PACKAGING INFO
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NPIC6C596APW-Q100J APPLICATIONS
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|
LIFECYCLE
|
Obsolete
Jun 30,2023
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|
PARAMETRIC INFO
|
| Logic Function |
Shift Register |
| Number of Count Input Enables |
0 |
| Number of Element Inputs |
1 |
| Number of Element Outputs |
9 |
| Number of Elements per Chip |
1 |
| Number of Selection Inputs per Element |
0 |
| Number of Stages |
8 |
| Operation Mode |
Serial to Serial/Parallel |
| Output Type |
Open Drain |
| Reset Type |
Asynchronous |
| Direction Type |
Uni-Directional |
| Terminal Count Output |
No |
| Triggering Type |
Positive-Edge/Negative-Edge |
| Minimum Operating Supply Voltage (V) |
2.3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
5(Typ)@5V |
| Absolute Propagation Delay Time (ns) |
97(Typ) |
| Propagation Delay Test Condition (pF) |
30 |
| Maximum Quiescent Current (mA) |
0.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Parallel Enable Input |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
|
|
| |
| APPLICATIONS |
| • LED sign |
| • Graphic status panel |
| • Fault status indicator |
| |
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