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• Low Profile Package for Space Constrained Applications
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• Rectangular Package for Automated Handling
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• Highly Stable Oxide Passivated Junction
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• 150°C Operating Junction Temperature
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• Guard−Ring for Stress Protection
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• These are Pb−Free and Halide−Free Devices
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CATALOG |
NRVBAF360T3G COUNTRY OF ORIGIN
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NRVBAF360T3G PARAMETRIC INFO
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NRVBAF360T3G PACKAGE INFO
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NRVBAF360T3G MANUFACTURING INFO
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NRVBAF360T3G PACKAGING INFO
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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Type |
Schottky Diode |
Configuration |
Single |
Maximum DC Reverse Voltage (V) |
60 |
Peak Reverse Repetitive Voltage (V) |
60 |
Maximum Continuous Forward Current (A) |
4 |
Maximum Forward Voltage (V) |
0.63@3A |
Peak Non-Repetitive Forward Surge Current (A) |
125 |
Peak Reverse Current (uA) |
30 |
Operating Junction Temperature (°C) |
-65 to 150 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-65 |
Maximum Operating Temperature (°C) |
150 |
Supplier Temperature Grade |
Automotive |
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PACKAGE INFO
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Supplier Package |
SMA-FL |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
2 |
Lead Shape |
Flat |
PCB |
2 |
Tab |
N/R |
Pin Pitch (mm) |
N/A |
Package Length (mm) |
4.3 |
Package Width (mm) |
2.6 |
Package Height (mm) |
1 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
SMD Plastic Package |
Package Family Name |
DO |
Jedec |
DO-221AC |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
CuFeZn |
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PACKAGING INFO
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Packaging Suffix |
T3 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
5000 |
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