NRVBAF360T3G onsemi DIODE SCHOTTKY 60V 4A SMA-FL

label:
2025/10/16 16
NRVBAF360T3G onsemi DIODE SCHOTTKY 60V 4A SMA-FL


• Low Profile Package for Space Constrained Applications
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction
• 150°C Operating Junction Temperature
• Guard−Ring for Stress Protection
• These are Pb−Free and Halide−Free Devices


CATALOG
NRVBAF360T3G COUNTRY OF ORIGIN
NRVBAF360T3G PARAMETRIC INFO
NRVBAF360T3G PACKAGE INFO
NRVBAF360T3G MANUFACTURING INFO
NRVBAF360T3G PACKAGING INFO


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Type Schottky Diode
Configuration Single
Maximum DC Reverse Voltage (V) 60
Peak Reverse Repetitive Voltage (V) 60
Maximum Continuous Forward Current (A) 4
Maximum Forward Voltage (V) 0.63@3A
Peak Non-Repetitive Forward Surge Current (A) 125
Peak Reverse Current (uA) 30
Operating Junction Temperature (°C) -65 to 150
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package SMA-FL
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape Flat
PCB 2
Tab N/R
Pin Pitch (mm) N/A
Package Length (mm) 4.3
Package Width (mm) 2.6
Package Height (mm) 1
Package Diameter (mm) N/R
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description SMD Plastic Package
Package Family Name DO
Jedec DO-221AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeZn


PACKAGING INFO
Packaging Suffix T3
Packaging Tape and Reel
Quantity Of Packaging 5000

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