|
|
• Fine Lithography Trench−based Schottky Technology for Very Low Forward Voltage and Low Leakage
|
• Fast Switching with Exceptional Temperature Stability
|
• Low Power Loss and Lower Operating Temperature
|
• Higher Efficiency for Achieving Regulatory Compliance
|
• Low Thermal Resistance
|
• High Surge Capability
|
• NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
|
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
|
|
| CATALOG |
NRVTS260ESFT1G COUNTRY OF ORIGIN
|
| NRVTS260ESFT1G LIFECYCLE |
NRVTS260ESFT1G PARAMETRIC INFO
|
NRVTS260ESFT1G PACKAGE INFO
|
NRVTS260ESFT1G MANUFACTURING INFO
|
NRVTS260ESFT1G PACKAGING INFO
|
NRVTS260ESFT1G APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
| LIFECYCLE |
Obsolete
Oct 08,2021 |
|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Maximum DC Reverse Voltage (V) |
60 |
| Peak Reverse Repetitive Voltage (V) |
60 |
| Maximum Continuous Forward Current (A) |
2 |
| Process Technology |
Trench |
| Maximum Forward Voltage (V) |
0.65 |
| Peak Non-Repetitive Forward Surge Current (A) |
50 |
| Peak Reverse Current (uA) |
12 |
| Operating Junction Temperature (°C) |
-65 to 175 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
175 |
| Supplier Temperature Grade |
Automotive |
|
|
PACKAGE INFO
|
| Supplier Package |
SOD-123FL |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Flat |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2.7 |
| Package Width (mm) |
1.65 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.6 |
| Package Overall Width (mm) |
1.65 |
| Package Overall Height (mm) |
0.95 |
| Seated Plane Height (mm) |
0.95 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
CuFeZnP |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
|
|
| APPLICATIONS |
| • Switching Power Supplies including Compact Adapters and Flat Panel Display |
| • High Frequency and DC−DC Converters |
| • Freewheeling and OR−ing diodes |
| • Reverse Battery Protection |
| • Instrumentation |
| |
One-stop supplier of IC products