|
|
• Fine Lithography Trench−based Schottky Technology for Very Low
Forward Voltage and Low Leakage
|
• Fast Switching with Exceptional Temperature Stability
|
• Low Power Loss and Lower Operating Temperature
|
• Higher Efficiency for Achieving Regulatory Compliance
|
• High Surge Capability
|
| • NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable |
| • These are Pb−Free and Halide−Free Devices |
|
| CATALOG |
NRVTSA4100ET3G COUNTRY OF ORIGIN
|
NRVTSA4100ET3G PARAMETRIC INFO
|
NRVTSA4100ET3G PACKAGE INFO
|
NRVTSA4100ET3G MANUFACTURING INFO
|
NRVTSA4100ET3G PACKAGING INFO
|
NRVTSA4100ET3G ECAD MODELS
|
NRVTSA4100ET3G APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Viet Nam
|
China
|
|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
100 |
| Maximum DC Reverse Voltage (V) |
100 |
| Maximum Continuous Forward Current (A) |
4 |
| Average Rectified Forward Current (A) |
4 |
| Maximum Junction Ambient Thermal Resistance |
90°C/W |
| Peak Forward Voltage (V) |
0.68 |
| Peak Non-Repetitive Surge Current (A) |
150 |
| Peak Reverse Current (uA) |
29 |
| Operating Junction Temperature (°C) |
-55 to 175 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
175 |
| Maximum Diode Capacitance (pF) |
55(Typ) |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
| Supplier Temperature Grade |
Automotive |
|
|
PACKAGE INFO
|
| Supplier Package |
SMA |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.32 |
| Package Width (mm) |
2.6 |
| Package Height (mm) |
2 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.21 |
| Package Overall Width (mm) |
2.6 |
| Package Overall Height (mm) |
2.1 |
| Seated Plane Height (mm) |
2.1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO-214-AC |
| Jedec |
DO-214AC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Anode Opposing Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Switching Power Supplies including Wireless, Smartphone and
Notebook Adapters
|
| • High Frequency and DC−DC Converters |
• Freewheeling and OR−ing diodes
|
| • Reverse Battery Protection |
| • Instrumentation |
| • D LED Lighting |
|
| |
One-stop supplier of IC products