NSVR0320MW2T1G onsemi DIODE SCHOTTKY 20V 1A SOD323

label:
2025/03/18 89
NSVR0320MW2T1G onsemi 	DIODE SCHOTTKY 20V 1A SOD323


• Low Forward Voltage − 0.24 Volts (Typ) @ IF = 10 mAdc
• High Current Capability
• NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant*


CATALOG
NSVR0320MW2T1G COUNTRY OF ORIGIN
NSVR0320MW2T1G PARAMETRIC INFO
NSVR0320MW2T1G PACKAGE INFO
NSVR0320MW2T1G MANUFACTURING INFO
NSVR0320MW2T1G PACKAGING INFO


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type Schottky Diode
Configuration Single
Peak Reverse Repetitive Voltage (V) 23
Maximum DC Reverse Voltage (V) 20
Maximum Continuous Forward Current (A) 1
Maximum Power Dissipation (mW) 200
Average Rectified Forward Current (A) 1
Typical Junction Capacitance (pF) 35(Max)
Maximum Junction Ambient Thermal Resistance 500°C/W
Peak Forward Voltage (V) 0.5@0.9A
Peak Non-Repetitive Surge Current (A) 5
Peak Reverse Current (uA) 50@15V
Operating Junction Temperature (°C) -55 to 125
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Maximum Diode Capacitance (pF) 29
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package SOD-323
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape Gull-wing
PCB 2
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) 1.7
Package Width (mm) 1.25
Package Height (mm) 0.85
Package Diameter (mm) N/R
Package Overall Length (mm) 2.5
Package Overall Width (mm) 1.25
Package Overall Height (mm) 0.9
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Diode Package
Package Family Name SOD
Jedec SOD-323
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeNi


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000


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