NTD3055L104T4G onsemi MOSFET N-CH 60V 12A DPAK

label:

2023/10/16 376

• Lower RDS(on)

• Lower VDS(on)

• Tighter VSD Specification

• Lower Diode Reverse Recovery Time

• Lower Reverse Recovery Stored Charge

• NTDV and STDV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable

• These Devices are Pb−Free and are RoHS Compliant

CATALOG

NTD3055L104T4G COUNTRY OF ORIGIN

NTD3055L104T4G PARAMETRIC INFO

NTD3055L104T4G PACKAGE INFO

NTD3055L104T4G MANUFACTURING INFO

NTD3055L104T4G PACKAGING INFO

NTD3055L104T4G ECAD MODELS

NTD3055L104T4G APPLICATIONS

COUNTRY OF ORIGIN

China

Czechia

Japan

Malaysia

United States of America

Viet Nam

PARAMETRIC INFO

Channel Type	N
Channel Mode	Enhancement
Configuration	Single
Maximum Drain Source Voltage (V)	60
Maximum Continuous Drain Current (A)	12
Maximum Gate Source Voltage (V)	±15
Maximum Drain Source Resistance (mOhm)	104@5V
Typical Gate Charge @ Vgs (nC)	7.4@5V
Operating Junction Temperature (°C)	-55 to 175
Maximum Power Dissipation (mW)	48000
Minimum Gate Threshold Voltage (V)	1
Category	Power MOSFET
Typical Output Capacitance (pF)	105
Maximum Junction Ambient Thermal Resistance	100°C/W
Maximum Junction Case Thermal Resistance	3.13°C/W
Maximum Positive Gate Source Voltage (V)	15
Typical Input Capacitance @ Vds (pF)	316@25V
Typical Gate Threshold Voltage (V)	1.6
Typical Reverse Transfer Capacitance @ Vds (pF)	35@25V
Typical Reverse Recovery Charge (nC)	40
Typical Diode Forward Voltage (V)	0.95
Maximum Diode Forward Voltage (V)	1.2
Typical Reverse Recovery Time (ns)	35
Typical Forward Transconductance (S)	9.1
Maximum Pulsed Drain Current @ TC=25°C (A)	45
Typical Turn-On Delay Time (ns)	9.2
Typical Turn-Off Delay Time (ns)	19
Typical Fall Time (ns)	40.5
Typical Rise Time (ns)	104
Maximum Gate Source Leakage Current (nA)	100
Maximum Gate Threshold Voltage (V)	2
Maximum IDSS (uA)	1
Number of Elements per Chip	1
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	175
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	175

PACKAGE INFO

Supplier Package	DPAK
Basic Package Type	Lead-Frame SMT
Pin Count	3
Lead Shape	Gull-wing
PCB	2
Tab	Tab
Pin Pitch (mm)	2.29
Package Length (mm)	6.73(Max)
Package Width (mm)	6.22(Max)
Package Height (mm)	2.38(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	6.73(Max)
Package Overall Width (mm)	10.41(Max)
Package Overall Height (mm)	2.51(Max)
Seated Plane Height (mm)	2.51(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Deca Watt Package
Package Family Name	TO-252
Jedec	TO-252AA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging Suffix	T4
Packaging	Tape and Reel
Quantity Of Packaging	2500
Reel Diameter (in)	13
Reel Width (mm)	16.4(Min)
Tape Pitch (mm)	8
Tape Width (mm)	16
Feed Hole Pitch (mm)	4
Hole Center to Component Center (mm)	2
Component Orientation	Tab Opposing Sprocket Hole
Packaging Document	Link to Datasheet
Tape Type	Embossed

ECAD MODELS

APPLICATIONS

• Power Supplies

• Converters

• Power Motor Controls

• Bridge Circuits