NTP2955G onsemi MOSFET P-CH 60V 2.4A TO220AB

label:

2024/05/22 291

• Low RDS(on)

• Rugged Performance

• Fast Switching

• These are Pb−Free Devices*

CATALOG

NTP2955G COUNTRY OF ORIGIN

NTP2955G PARAMETRIC INFO

NTP2955G PACKAGE INFO

NTP2955G MANUFACTURING INFO

NTP2955G PACKAGING INFO

NTP2955G EACD MODELS

NTP2955G APPLICATIONS

COUNTRY OF ORIGIN

China

PARAMETRIC INFO

Channel Type	P
Channel Mode	Enhancement
Configuration	Single
Maximum Drain Source Voltage (V)	60
Maximum Continuous Drain Current (A)	2.4
Maximum Gate Source Voltage (V)	±20
Maximum Drain Source Resistance (mOhm)	196@10V
Typical Gate Charge @ Vgs (nC)	14@10V
Typical Gate Charge @ 10V (nC)	14
Maximum Power Dissipation (mW)	2400
Category	Power MOSFET
Typical Input Capacitance @ Vds (pF)	507@25V
Typical Turn-On Delay Time (ns)	10
Typical Turn-Off Delay Time (ns)	27
Typical Fall Time (ns)	45
Typical Rise Time (ns)	41
Number of Elements per Chip	1
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	175

Supplier Package	TO-220AB
Basic Package Type	Through Hole
Pin Count	3
Lead Shape	Through Hole
PCB	3
Tab	Tab
Pin Pitch (mm)	2.66(Max)
Package Length (mm)	10.53(Max)
Package Width (mm)	4.83(Max)
Package Height (mm)	9.28(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	19.68(Max)
Mounting	Through Hole
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Transistor Outline Package
Package Family Name	TO
Jedec	TO-220AB
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	N/R
Maximum Reflow Temperature (°C)	N/R
Reflow Solder Time (Sec)	N/R
Maximum Wave Temperature (°C)	260
Wave Solder Time (Sec)	10
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu

Packaging	Tube
Quantity Of Packaging	50
Packaging Document	Link to Datasheet

• Industrial

• Automotive

• Power Supplies