|
|
| • Low Clamping Voltage |
| • Stand−Off Voltage: 5 V |
| • Low Leakage |
| • Protection for the Following IEC Standards:
IEC 61000−4−2 Level 4 ESD Protection
|
| • UL Flammability Rating of 94 V−0 |
| • SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable |
| • These Devices are Pb−Free and are RoHS Compliant |
|
| CATALOG |
| NUP2201MR6T1G COUNTRY OF ORIGIN |
| NUP2201MR6T1G PARAMETRIC INFO |
| NUP2201MR6T1G PACKAGE INFO |
| NUP2201MR6T1G MANUFACTURING INFO |
| NUP2201MR6T1G PACKAGING INFO |
| NUP2201MR6T1G ECAD MODELS |
| NUP2201MR6T1G APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| ThailandThailand |
| United States of America |
|
PARAMETRIC INFO
|
| type |
diode array |
| direction type |
bi-directional |
| maximum working voltage (v) |
5 |
| configuration |
dual |
| maximum clamping voltage (v) |
20 |
| maximum leakage current (ua) |
5 |
| operating junction temperature (°c) |
-40 to 125 |
| number of elements per chip |
2 |
| test current (ma) |
1 |
| peak pulse power dissipation (w) |
500 |
| maximum peak pulse current (a) |
25 |
| minimum breakdown voltage (v) |
6 |
| minimum operating temperature (°c) |
-40 |
| fail safe protection |
no |
| maximum operating temperature (°c) |
125 |
| minimum storage temperature (°c) |
-55 |
| maximum storage temperature (°c) |
150 |
|
PACKAGE INFO
|
| Supplier Package |
TSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3 |
| Package Width (mm) |
1.5 |
| Package Height (mm) |
0.94 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
2.75 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
N/A |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| PACKAGING INFO |
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • High Speed Communication Line Protection |
| • USB 1.1 and 2.0 Power and Data Line Protection |
| • Digital Video Interface (DVI) |
| • Monitors and Flat Panel Displays |
|
One-stop supplier of IC products