NUP2201MR6T1G onsemi TVS DIODE 5V 20V 6TSOP

label:
2023/09/7 300



• Low Clamping Voltage
• Stand−Off Voltage: 5 V
• Low Leakage
• Protection for the Following IEC Standards: IEC 61000−4−2 Level 4 ESD Protection  
• UL Flammability Rating of 94 V−0
• SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant


CATALOG  
NUP2201MR6T1G COUNTRY OF ORIGIN
NUP2201MR6T1G PARAMETRIC INFO
NUP2201MR6T1G PACKAGE INFO 
NUP2201MR6T1G MANUFACTURING INFO
NUP2201MR6T1G PACKAGING INFO
NUP2201MR6T1G ECAD MODELS
NUP2201MR6T1G APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
ThailandThailand
United States of America


PARAMETRIC INFO
type diode array
direction type bi-directional
maximum working voltage (v) 5
configuration dual
maximum clamping voltage (v) 20
maximum leakage current (ua) 5
operating junction temperature (°c) -40 to 125
number of elements per chip 2
test current (ma) 1
peak pulse power dissipation (w) 500
maximum peak pulse current (a) 25
minimum breakdown voltage (v) 6
minimum operating temperature (°c) -40
fail safe protection no
maximum operating temperature (°c) 125
minimum storage temperature (°c) -55
maximum storage temperature (°c) 150
 

PACKAGE INFO 
Supplier Package TSOP
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3
Package Width (mm) 1.5
Package Height (mm) 0.94
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 2.75
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Package
Package Family Name SOP
Jedec N/A
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 

PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 8.4(Min)
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q3
Packaging Document Link to Datasheet
Tape Type Embossed
 

ECAD MODELS


APPLICATIONS
• High Speed Communication Line Protection
• USB 1.1 and 2.0 Power and Data Line Protection
• Digital Video Interface (DVI)
• Monitors and Flat Panel Displays


Продукт RFQ