
|
|
• Low Clamping Voltage |
• Stand−Off Voltage: 5 V |
• Low Leakage |
• Protection for the Following IEC Standards:
IEC 61000−4−2 Level 4 ESD Protection
|
• UL Flammability Rating of 94 V−0 |
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable |
• These Devices are Pb−Free and are RoHS Compliant |
|
CATALOG |
NUP2201MR6T1G COUNTRY OF ORIGIN |
NUP2201MR6T1G PARAMETRIC INFO |
NUP2201MR6T1G PACKAGE INFO |
NUP2201MR6T1G MANUFACTURING INFO |
NUP2201MR6T1G PACKAGING INFO |
NUP2201MR6T1G ECAD MODELS |
NUP2201MR6T1G APPLICATIONS |
|
COUNTRY OF ORIGIN |
Malaysia |
ThailandThailand |
United States of America |
|
PARAMETRIC INFO
|
type |
diode array |
direction type |
bi-directional |
maximum working voltage (v) |
5 |
configuration |
dual |
maximum clamping voltage (v) |
20 |
maximum leakage current (ua) |
5 |
operating junction temperature (°c) |
-40 to 125 |
number of elements per chip |
2 |
test current (ma) |
1 |
peak pulse power dissipation (w) |
500 |
maximum peak pulse current (a) |
25 |
minimum breakdown voltage (v) |
6 |
minimum operating temperature (°c) |
-40 |
fail safe protection |
no |
maximum operating temperature (°c) |
125 |
minimum storage temperature (°c) |
-55 |
maximum storage temperature (°c) |
150 |
|
PACKAGE INFO
|
Supplier Package |
TSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
Gull-wing |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
3 |
Package Width (mm) |
1.5 |
Package Height (mm) |
0.94 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3 |
Package Overall Width (mm) |
2.75 |
Package Overall Height (mm) |
1 |
Seated Plane Height (mm) |
1 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Small Outline Package |
Package Family Name |
SOP |
Jedec |
N/A |
|
MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
|
PACKAGING INFO |
Packaging Suffix |
T1 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Reel Width (mm) |
8.4(Min) |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Feed Hole Pitch (mm) |
4 |
Hole Center to Component Center (mm) |
2 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
Tape Type |
Embossed |
|
ECAD MODELS |
|
|
APPLICATIONS |
• High Speed Communication Line Protection |
• USB 1.1 and 2.0 Power and Data Line Protection |
• Digital Video Interface (DVI) |
• Monitors and Flat Panel Displays |
|