|
|
• Low Clamping Voltage
|
• Stand−Off Voltage: 5 V
|
• Low Leakage
|
• TSOP−6 is footprint compatible with SC−74, SC−59 6 Lead and SOT−23 6 Lead
|
• Protection for the Following IEC Standards: IEC 61000−4−2 Level 4 ESD Protection
|
• UL Flammability Rating of 94 V−0
|
• Pb−Free Package is Available
|
|
| CATALOG |
NUP4201MR6T1G COUNTRY OF ORIGIN
|
NUP4201MR6T1G LIFECYCLE
|
NUP4201MR6T1G PARAMETRIC INFO
|
NUP4201MR6T1G PACKAGE INFO
|
NUP4201MR6T1G MANUFACTURING INFO
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NUP4201MR6T1G PACKAGING INFO
|
NUP4201MR6T1G ECAD MODELS
|
NUP4201MR6T1G APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Thailand
|
|
LIFECYCLE
|
Obsolete
Aug 05,2016
|
|
PARAMETRIC INFO
|
| Type |
Diode Array |
| Direction Type |
Uni-Directional |
| Maximum Working Voltage (V) |
5 |
| Configuration |
Quad |
| Capacitance Value (pF) |
5 |
| Maximum Clamping Voltage (V) |
20 |
| Maximum Leakage Current (uA) |
5 |
| Number of Elements per Chip |
4 |
| Peak Pulse Power Dissipation (W) |
500 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3 |
| Package Width (mm) |
1.5 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
2.75 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
CuFeAgZn |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
|
|
| ECAD MODELS |
|
|
| APPLICATIONS |
• High Speed Communication Line Protection
|
• USB 1.1 and 2.0 Power and Data Line Protection
|
• Digital Video Interface (DVI)
|
• Monitors and Flat Panel Displays
|
| |
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