OP177GSZ-REEL Analog Devices IC OPAMP GP 600KHZ 8SOIC

label:
2024/01/29 306

 
• Ultralow offset voltage
   - TA = 25°C, 25 μV maximum
• Outstanding offset voltage drift 0.3 μV/°C maximum
• Excellent open-loop gain and gain linearity
   - 12 V/μV typical
• CMRR: 130 dB minimum
• PSRR: 115 dB minimum
• Low supply current 2.0 mA maximum
• Fits industry-standard precision operational amplifier sockets


CATALOG
OP177GSZ-REEL COUNTRY OF ORIGIN
OP177GSZ-REEL PARAMETRIC INFO
OP177GSZ-REEL PACKAGE INFO
OP177GSZ-REEL MANUFACTURING INFO
OP177GSZ-REEL PACKAGING INFO
OP177GSZ-REEL ECAD MODELS  
OP177GSZ-REEL FUNCTIONAL BLOCK DIAGRAM


COUNTRY OF ORIGIN
China

 
PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Number of Channels per Chip 1
Process Technology Bipolar
Minimum PSRR (dB) 110
Maximum Quiescent Current (mA) 2@±15V
Minimum Dual Supply Voltage (V) ±3
Typical Gain Bandwidth Product (MHz) 0.6
Maximum Input Offset Voltage (mV) 0.06@±15V
Typical Dual Supply Voltage (V) ±5|±9|±12|±15
Maximum Input Offset Current (uA) 0.0028@±15V
Maximum Dual Supply Voltage (V) ±18
Maximum Input Voltage Range (V) ±14
Maximum Operating Supply Voltage (V) ±18
Maximum Input Bias Current (uA) 0.0028@±15V
Minimum CMRR (dB) 115
Maximum Supply Voltage Range (V) 36 to 37
Minimum CMRR Range (dB) >=115
Typical Voltage Gain (dB) 135.56
Typical Slew Rate (V/us) 0.3@±15V
Minimum Slew Rate (V/us) 0.1@±15V
Typical Input Offset Current (uA) 0.0003@±15V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Extended Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 125
Power Supply Type Dual
Maximum Power Dissipation (mW) 500
Typical Output Resistance (Ohm) 60
Input Offset Voltage Drift (uV/°C) 1.2
 
PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Suffix REEL
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed
 
ECAD MODELS  


FUNCTIONAL BLOCK DIAGRAM

Продукт RFQ