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• Focused and non-focused optical light pattern
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• Enhanced temperature range
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• TO-46 hermetically sealed package
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• Mechanically and spectrally matched to other Optek devices
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• Choice of power ranges
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• Choice of narrow or wide irradiance pattern
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CATALOG |
OP233 COUNTRY OF ORIGIN
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OP233 PARAMETRIC INFO
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OP233 PACKAGE INFO
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OP233 MANUFACTURING INFO
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OP233 PACKAGING INFO
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OP233 APPLICATIONS
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COUNTRY OF ORIGIN
|
Mexico
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PARAMETRIC INFO
|
Viewing Angle (°) |
18 |
Mounting Orientation |
Top Mount |
Lens Shape Type |
Circular |
High Brightness |
No |
Peak Wavelength (nm) |
890 |
Maximum Forward Voltage (V) |
2 |
Maximum Forward Current (mA) |
100 |
LED Material |
GaAlAs |
Maximum Power Dissipation (mW) |
200 |
Minimum Operating Temperature (°C) |
-65 |
Reverse Voltage (V) |
2 |
Maximum Operating Temperature (°C) |
125 |
Maximum Reverse Current (uA) |
100 |
Temperature Flag |
Opr |
High Power |
Yes |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Test Current (mA) |
10 |
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PACKAGE INFO
|
Supplier Package |
TO-46 |
Basic Package Type |
Through Hole |
Pin Count |
2 |
Lead Shape |
Through Hole |
PCB |
2 |
Tab |
N/R |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
N/R |
Package Width (mm) |
N/R |
Package Height (mm) |
5.59 |
Package Diameter (mm) |
6.35 |
Seated Plane Height (mm) |
N/A |
Mounting |
Through Hole |
Package Description |
Transistor Outline Package |
Package Family Name |
TO |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Maximum Wave Temperature (°C) |
N/A |
Wave Solder Time (Sec) |
N/A |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
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PACKAGING INFO
|
Packaging |
Bag |
Packaging Document |
Link to Datasheet |
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APPLICATIONS
|
• Non-contact reflective object sensor
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• Assembly line automation
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• Machine automation
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• Machine safety
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• End of travel sensor
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• Door sensor
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