OP400FY Analog Devices IC OPAMP GP 500KHZ 14CDIP

label:
2023/10/24 329



• Low input offset voltage: 150 μV (maximum)
• Low offset voltage drift over –55°C to +125°C: 1.2 μV/°C (maximum)
• Low supply current (per amplifier): 725 μA (maximum)
• High open-loop gain: 5000 V/mV (minimum)
• Input bias current: 3 nA (maximum)
• Low noise voltage density: 11 nV/√Hz at 1 kHz
• Stable with large capacitive loads: 10 nF typical
• Available in die form


CATALOG
OP400FY COUNTRY OF ORIGIN
OP400FY PARAMETRIC INFO
OP400FY PACKAGE INFO
OP400FY MANUFACTURING INFO
OP400FY PACKAGING INFO
OP400FY ECAD MODELS
OP400FY FUNCTIONAL BLOCK DIAGRAM


COUNTRY OF ORIGIN
China
Philippines
United States of America


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Number of Channels per Chip 4
Minimum PSRR (dB) 140(Typ)
Output Type Differential
Maximum Quiescent Current (mA) 2.9@±15V
Minimum Dual Supply Voltage (V) ±3
Typical Gain Bandwidth Product (MHz) 0.5
Maximum Input Offset Voltage (mV) 0.23@±15V
Typical Dual Supply Voltage (V) ±5|±9|±12|±15|±18
Maximum Input Offset Current (uA) 0.002@±15V
Maximum Dual Supply Voltage (V) ±20
Maximum Operating Supply Voltage (V) ±20
Maximum Input Bias Current (uA) 0.006@±15V
Minimum CMRR (dB) 115
Maximum Supply Voltage Range (V) 37 to 44
Minimum CMRR Range (dB) >=115
Typical Voltage Gain (dB) 136.9
Typical Slew Rate (V/us) 0.15@±15V
Typical Input Noise Voltage Density (nV/rtHz) 22@±15V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.6@±15V
Shut Down Support No
Minimum Operating Temperature (°C) -25
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Dual


PACKAGE INFO
Supplier Package CDIP
Basic Package Type Through Hole
Pin Count 14
Lead Shape Through Hole
PCB 14
Tab N/R
Package Length (mm) 19.94(Max)
Package Width (mm) 7.87(Max)
Package Height (mm) 3.56(Max)
Package Diameter (mm) N/R
Mounting Through Hole
Package Material Ceramic
Package Description Ceramic Dual In Line Package
Package Family Name DIP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 60
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnPb
Under Plating Material Ag
Terminal Base Material FeNi Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 25
Packaging Document Link to Datasheet


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM

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