OP4177ARZ-REEL7 Analog Devices IC OPAMP GP 1.3MHZ 14SOIC

label:
2024/08/2 225



• Low offset voltage: 60 μV maximum
• Very low offset voltage drift: 0.7 μV/°C maximum
• Low input bias current: 2 nA maximum
• Low noise: 8 nV/√Hz typical
• CMRR, PSRR, and AVO > 120 dB minimum
• Low supply current: 400 μA per amplifier
• Dual supply operation: ±2.5 V to ±15 V
• Unity-gain stable
• No phase reversal
• Inputs internally protected beyond supply voltage


CATALOG
OP4177ARZ-REEL7 COUNTRY OF ORIGIN
OP4177ARZ-REEL7 PARAMETRIC INFO
OP4177ARZ-REEL7 PACKAGE INFO
OP4177ARZ-REEL7 MANUFACTURING INFO
OP4177ARZ-REEL7 PACKAGING INFO
OP4177ARZ-REEL7 ECAD MODELS
OP4177ARZ-REEL7 APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Philippines


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Number of Channels per Chip 4
Minimum PSRR (dB) 118
Minimum Dual Supply Voltage (V) ±2.5
Typical Gain Bandwidth Product (MHz) 1.3
Maximum Input Offset Voltage (mV) 0.075@±5V
Typical Dual Supply Voltage (V) ±3|±5|±9|±12
Maximum Input Offset Current (uA) 0.001@±5V@-40C to 125C
Maximum Dual Supply Voltage (V) ±15
Maximum Input Voltage Range (V) -3.5 to 3.5
Maximum Operating Supply Voltage (V) ±15
Maximum Input Bias Current (uA) 0.002@±5V@-40C to 125C
Minimum CMRR (dB) 120
Maximum Supply Voltage Range (V) 30 to 32
Minimum CMRR Range (dB) >=115
Typical Voltage Gain (dB) 126.02
Typical Slew Rate (V/us) 0.7@±5V
Typical Output Current (mA) 10@±5V
Typical Input Noise Voltage Density (nV/rtHz) 7.9@±5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.2@±5V
Typical Input Bias Current (uA) 0.0002@±5V@-40C to 125C
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Dual
Maximum Supply Current (mA) 2@±5V
Typical High Level Output Voltage (V) 14.1
Typical Low Level Output Voltage (V) -14.1
Input Offset Voltage Drift (uV/°C) 0.9


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix REEL7
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed


ECAD MODELS


APPLICATIONS
• Wireless base station control circuits
• Optical network control circuits
• Instrumentation
• Sensors and controls Thermocouples Resistor thermal detectors (RTDs) Strain bridges Shunt current measurements
• Precision filters
Продукт RFQ