OP77FJZ Analog Devices IC OPAMP GP 600KHZ TO99-8

label:
August 5th, 2025 42
OP77FJZ Analog Devices IC OPAMP GP 600KHZ TO99-8


• Outstanding gain linearity
• Ultrahigh gain, 5000 V/mV min
• Low VOS over temperature, 55 μV max
• TCVOS, 0.3 μV/°C max
• High PSRR, 3 μV/V max
• Low power consumption, 60 mW max
• Available in die form


CATALOG
OP77FJZ COUNTRY OF ORIGIN
OP77FJZ PARAMETRIC INFO
OP77FJZ PACKAGE INFO
OP77FJZ MANUFACTURING INFO
OP77FJZ PACKAGING INFO
OP77FJZ ECAD MODELS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Manufacturer Type Ultra Low Offset Voltage Amplifier
Type Ultra Low Offset Voltage Amplifier
Number of Channels per Chip 1
Minimum PSRR (dB) 123.1(Typ)
Typical Gain Bandwidth Product (MHz) 0.6
Minimum Dual Supply Voltage (V) ±3
Typical Dual Supply Voltage (V) ±5|±9|±12|±15|±18
Maximum Input Offset Voltage (mV) 0.06@±15V
Maximum Dual Supply Voltage (V) ±22
Maximum Input Offset Current (uA) 0.0028@±15V
Maximum Input Bias Current (uA) 0.0028@±15V
Maximum Operating Supply Voltage (V) ±22
Maximum Supply Voltage Range (V) >=44
Minimum CMRR (dB) 140(Typ)
Minimum CMRR Range (dB) >=115
Typical Voltage Gain (dB) 135.56
Typical Slew Rate (V/us) 0.3@±15V
Typical Input Noise Voltage Density (nV/rtHz) 10.5@±15V
Shut Down Support No
Minimum Operating Temperature (°C) -25
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Dual


PACKAGE INFO
Supplier Package TO-99
Basic Package Type Through Hole
Pin Count 8
Lead Shape Through Hole
PCB 8
Tab N/R
Pin Pitch (mm) N/A
Package Length (mm) N/R
Package Width (mm) N/R
Package Height (mm) 4.7(Max)
Package Diameter (mm) 9.4(Max)
Seated Plane Height (mm) 4.7(Max)
Mounting Through Hole
Package Material Metal
Package Description Transistor Outline Package
Package Family Name TO
Jedec TO-99
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/A


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 100
Packaging Document Link to Datasheet
 
ECAD MODELS
Product RFQ