 |
|
| • Superior Sound Quality |
| • Ultralow Noise: 1.1 nV/√Hz at 1 kHz |
• Ultralow Distortion:
- 0.000015% at 1 kHz |
| • High Slew Rate: 27 V/μs |
| • Wide Bandwidth: 40 MHz (G = +1) |
| • High Open-Loop Gain: 130 dB |
| • Unity Gain Stable |
• Low Quiescent Current:
- 3.6 mA per Channel |
| • Rail-to-Rail Output |
| • Wide Supply Range: ±2.25 V to ±18 V |
| • Single and Dual Versions Available |
|
| CATALOG |
| OPA1612AIDR COUNTRY OF ORIGIN |
| OPA1612AIDR PARAMETRIC INFO |
| OPA1612AIDR PACKAGE INFO |
| OPA1612AIDR MANUFACTURING INFO |
| OPA1612AIDR PACKAGING INFO |
| OPA1612AIDR ECAD MODELS |
| OPA1612AIDR FUNCTIONAL BLOCK DIAGRAM |
| OPA1612AIDR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
| PARAMETRIC INFO |
| Amplifier Type |
Class-AB |
| Function |
Speaker |
| Rail to Rail |
Rail to Rail Output |
| Input Signal Type |
Differential |
| Output Signal Type |
Single |
| Output Type |
1-Channel Mono |
| Power Supply Type |
Single|Dual |
| Minimum Single Supply Voltage (V) |
4.5 |
| Typical Single Supply Voltage (V) |
5|9|12|15|18|24|28 |
| Process Technology |
Bipolar |
| Maximum Single Supply Voltage (V) |
36 |
| Minimum Dual Supply Voltage (V) |
±2.25 |
| Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15 |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Input Offset Voltage (mV) |
0.5@±18V |
| Maximum Load Resistance (Ohm) |
2000 |
| Typical Gain Bandwidth Product (MHz) |
80 |
| Maximum Input Bias Current (uA) |
0.25@±18V |
| Typical PSRR (dB) |
140 |
| Typical Quiescent Current (mA) |
3.6@±18V |
| Maximum Quiescent Current (mA) |
4.5@±18V |
| Minimum CMRR (dB) |
110 |
| Total Harmonic Distortion Noise |
0.000015% |
| Typical Voltage Gain (dB) |
130 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
| PACKAGE INFO |
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
|
|
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Professional Audio Equipment |
| • Microphone Preamplifiers |
| • Analog and Digital Mixing Consoles |
| • Broadcast Studio Equipment |
| • Audio Test And Measurement |
| • High-End A/V Receivers |
| |
| |
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