OPA2134UA/2K5 Texas Instruments IC OPAMP AUDIO 8MHZ 8SOIC

label:
2024/01/12 346



• Superior Sound Quality
• Ultra Low Distortion: 0.00008%
• Low Noise: 8 nV/√Hz
• True FET-Input: IB = 5p
• High Speed:
   – Slew Rate: 20 V/µs
   – Bandwidth: 8 MHz
• High Open-Loop Gain: 120 dB (600 Ω)  
• Wide Supply Range: ±2.5 V to ±18 V
• Single, Dual, and Quad Versions



CATALOG
OPA2134UA/2K5 COUNTRY OF ORIGIN
OPA2134UA/2K5 PARAMETRIC INFO
OPA2134UA/2K5 PACKAGE INFO
OPA2134UA/2K5 MANUFACTURING INFO
OPA2134UA/2K5 PACKAGING INFO
OPA2134UA/2K5 ECAD MODELS
OPA2134UA/2K5 FUNCTIONAL BLOCK DIAGRAM
OPA2134UA/2K5 APPLICATIONS



COUNTRY OF ORIGIN
Taiwan (Province of China)
Malaysia
China
Thailand
Philippines



PARAMETRIC INFO
Amplifier Type Class-AB
Function Speaker
Input Signal Type Differential
Output Signal Type Single
Output Type 2-Channel Stereo
Power Supply Type Single|Dual
Minimum Single Supply Voltage (V) 5
Typical Single Supply Voltage (V) 9|12|15|18|24|28
Maximum Single Supply Voltage (V) 36
Minimum Dual Supply Voltage (V) ±2.5
Typical Dual Supply Voltage (V) ±15
Maximum Dual Supply Voltage (V) ±18
Maximum Input Offset Voltage (mV) 2@±15V
Maximum Load Resistance (Ohm) 2000
Typical Gain Bandwidth Product (MHz) 8
Maximum Input Bias Current (uA) 0.0001@±15V
Typical PSRR (dB) 106
Typical Quiescent Current (mA) 4@±15V
Maximum Quiescent Current (mA) 5@±15V
Minimum CMRR (dB) 86
Typical Voltage Gain (dB) 120
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
 


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 


PACKAGING INFO
Packaging Suffix 2K5
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
 


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Professional Audio and Music
• Line Drivers  
• Line Receivers
• Multimedia Audio
• Active Filters
• Preamplifiers
• Integrators
• Crossover Networks
Продукт RFQ