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• Low Offset Voltage: ±100 µV (maximum)
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• Low Offset Voltage Drift: ±0.5 µV/°C (typical)
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• Low Bias Current: ±5 pA (typical)
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• High Common-Mode Rejection: 140 dB
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• Low Noise: 15 nV/√Hz at 1 kHz
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• Rail-to-Rail Input and Output |
• Differential Input Voltage Range to Supply Rail |
• Wide Bandwidth: 2.5-MHz GBW |
• Low Quiescent Current: 140 µA per Amplifier
(typical) |
• Wide Supply: ±2.25 V to ±18 V, 4.5 V to 36 V |
• EMI/RFI Filtered Inputs |
• High Capacitive Load Drive Capability: 1 nF |
• Industry Standard Packages:
– Single in SOIC-8, SOT-5, and VSSOP-8
– Dual in SOIC-8 and VSSOP-8
– Quad in SOIC-14, TSSOP-14, and QFN-16 |
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CATALOG |
OPA2196ID COUNTRY OF ORIGIN
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OPA2196ID PARAMETRIC INFO
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OPA2196ID PACKAGE INFO
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OPA2196ID MANUFACTURING INFO
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OPA2196ID PACKAGING INFO
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OPA2196ID ECAD MODELS
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OPA2196ID APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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Manufacturer Type |
Low Offset Voltage Amplifier |
Type |
Low Offset Voltage Amplifier |
Rail to Rail |
Rail to Rail Input/Output |
Minimum Single Supply Voltage (V) |
4.5 |
Number of Channels per Chip |
2 |
Minimum PSRR (dB) |
130.46(Typ) |
Typical Single Supply Voltage (V) |
5|9|12|15|18|24|28 |
Typical Input Resistance (Ohm) |
10T |
Maximum Single Supply Voltage (V) |
36 |
Maximum Quiescent Current (mA) |
0.4@36V |
Minimum Dual Supply Voltage (V) |
±2.25 |
Typical Gain Bandwidth Product (MHz) |
2.5 |
Maximum Input Offset Voltage (mV) |
0.1@±18V |
Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15 |
Maximum Input Offset Current (uA) |
0.00002@36V |
Maximum Dual Supply Voltage (V) |
±18 |
Maximum Operating Supply Voltage (V) |
±18|36 |
Maximum Input Bias Current (uA) |
0.00002@36V |
Minimum CMRR (dB) |
96 |
Maximum Supply Voltage Range (V) |
36 to 37 |
Minimum CMRR Range (dB) |
95 to 105 |
Typical Voltage Gain (dB) |
140 |
Typical Slew Rate (V/us) |
7.5@±18V |
Typical Input Offset Current (uA) |
0.000002@36V |
Typical Settling Time (ns) |
3700 |
Typical Output Current (mA) |
65 |
Typical Input Noise Voltage Density (nV/rtHz) |
53@36V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.0015@36V |
Typical Input Bias Current (uA) |
0.000005@36V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Single|Dual |
Typical Output Resistance (Ohm) |
700 |
Input Offset Voltage Drift (uV/°C) |
±0.8(Typ) |
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PACKAGE INFO
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Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
3.98(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.19(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tube |
Quantity Of Packaging |
75 |
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ECAD MODELS
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APPLICATIONS
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• Multiplexed Data-Acquisition Systems
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• Test and Measurement Equipment |
• High-Resolution ADC Driver Amplifiers
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• SAR ADC Reference Buffers
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• Analog Input and Output Modules
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• High-Side and Low-Side Current Sensing |
• High-Precision Comparator |
• Medical Instrumentation
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