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• MicroSIZE PACKAGES
OPA244 (Single): SOT-23-5
OPA2244 (Dual): MSOP-8
OPA4244 (Quad): TSSOP-14
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• MicroPOWER: IQ = 50µA/channel
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• SINGLE SUPPLY OPERATION
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• WIDE BANDWIDTH: 430kHz
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| • WIDE SUPPLY RANGE:
Single Supply: 2.2V to 36V
Dual Supply: ±1.1V to ±18V |
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| CATALOG |
OPA2244EA/2K5 COUNTRY OF ORIGIN
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OPA2244EA/2K5 PARAMETRIC INFO
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OPA2244EA/2K5 PACKAGE INFO
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OPA2244EA/2K5 MANUFACTURING INFO
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OPA2244EA/2K5 PACKAGING INFO
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OPA2244EA/2K5 ECAD MODELS
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OPA2244EA/2K5 APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Malaysia
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Thailand
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PARAMETRIC INFO
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| Manufacturer Type |
Low Power Amplifier |
| Type |
Low Power Amplifier |
| Minimum Single Supply Voltage (V) |
2.2 |
| Number of Channels per Chip |
2 |
| Process Technology |
Bipolar |
| Minimum PSRR (dB) |
106.02(Typ) |
| Typical Single Supply Voltage (V) |
3|5|9|12|15|18|24|28 |
| Maximum Single Supply Voltage (V) |
36 |
| Minimum Dual Supply Voltage (V) |
±1.1 |
| Typical Gain Bandwidth Product (MHz) |
0.43 |
| Maximum Input Offset Voltage (mV) |
1.5@±7.5V |
| Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15 |
| Maximum Input Offset Current (uA) |
0.01@36V |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Operating Supply Voltage (V) |
±18|36 |
| Maximum Input Bias Current (uA) |
0.025@36V |
| Minimum CMRR (dB) |
72 |
| Maximum Supply Voltage Range (V) |
36 to 37 |
| Minimum CMRR Range (dB) |
71 to 75 |
| Typical Voltage Gain (dB) |
106 |
| Typical Slew Rate (V/us) |
0.16@36V |
| Typical Settling Time (ns) |
150000 |
| Typical Input Noise Voltage Density (nV/rtHz) |
22@36V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.04@36V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Power Supply Type |
Single|Dual |
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|
PACKAGE INFO
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| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.95 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
3.1 |
| Minimum PACKAGE_DIMENSION_L |
2.9 |
| Maximum PACKAGE_DIMENSION_W |
3.1 |
| Minimum PACKAGE_DIMENSION_W |
2.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
N/A |
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|
MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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|
PACKAGING INFO
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| Packaging Suffix |
2K5 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• BATTERY POWERED SYSTEMS
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| • PORTABLE EQUIPMENT |
• PCMCIA CARDS
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• BATTERY PACKS AND POWER SUPPLIES
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• CONSUMER PRODUCTS
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| |
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