OPA2277UA Texas Instruments OPAx277 High-Precision Operational Amplifiers

label:
2023/12/1 390



• Ultra-low offset voltage: 10 μV
• Ultra-low drift: ±0.1 μV/°C
• High open-loop gain: 134 dB
• High common-mode rejection: 140 dB
• High power-supply rejection: 130 dB
• Low bias current: 1-nA maximum
• Wide supply range: ±2 V to ±18 V
• Low quiescent current: 800 μA/amplifier
• Single, dual, and quad versions
• Replaces OP-07, OP-77, and OP-177
• For similar performance with ±40-V overvoltage protection, see the OPA2206


CATALOG
OPA2277UA COUNTRY OF ORIGIN
OPA2277UA PARAMETRIC INFO
OPA2277UA PACKAGE INFO
OPA2277UA MANUFACTURING INFO
OPA2277UA PACKAGING INFO
OPA2277UA ECAD MODELS
OPA2277UA APPLICATIONS


COUNTRY OF ORIGIN
China
Philippines
Malaysia
Taiwan (Province of China)
Thailand
United States of America


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Minimum Single Supply Voltage (V) 4
Number of Channels per Chip 2
Minimum PSRR (dB) 130.46(Typ)
Typical Single Supply Voltage (V) 30
Typical Input Resistance (Ohm) 250G
Maximum Single Supply Voltage (V) 36
Maximum Quiescent Current (mA) 1.65@30V
Minimum Dual Supply Voltage (V) ±2
Typical Gain Bandwidth Product (MHz) 1
Maximum Input Offset Voltage (mV) 0.05@30V
Typical Dual Supply Voltage (V) ±15
Maximum Input Offset Current (uA) 0.0028@30V
Maximum Dual Supply Voltage (V) ±18
Maximum Operating Supply Voltage (V) ±18|36
Maximum Input Bias Current (uA) 0.0028@30V
Minimum CMRR (dB) 115
Maximum Supply Voltage Range (V) 36 to 37
Minimum CMRR Range (dB) >=115
Typical Voltage Gain (dB) 140
Typical Slew Rate (V/us) 0.8@30V
Typical Input Offset Current (uA) 0.0005@30V
Typical Settling Time (ns) 16000
Typical Output Current (mA) 35
Typical Input Noise Voltage Density (nV/rtHz) 12@30V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.2@30V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Power Supply Type Single|Dual
Typical Output Resistance (Ohm) 40


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 75


ECAD MODELS



APPLICATIONS
• Analog input module
• Weigh scale
• Temperature transmitter
• Pressure transmitter
• Data acquisition (DAQ)
• Lab and field instrumentation
• Battery test
Продукт RFQ