OPA2348AIDCNR Texas Instruments OPAx348 1-MHz, 45-µA, CMOS, Rail-to-Rail Operational Amplifiers

label:
2024/04/1 259



• Low IQ: 45 µA (Typical)
• Rail-To-Rail Input and Output
• Single Supply: 2.1 V to 5.5 V
• Input Bias Current: 0.5 pA
• Micro Size Packages:– 5-Pin SC70– 8-Pin SOT-23– 14-Pin TSSOP
• Excellent Bandwidth-to-Power Consumption Trade-off
• Number of Channels:– OPA348: 1– OPA2348: 2– OPA4348: 4


CATALOG
OPA2348AIDCNR COUNTRY OF ORIGIN
OPA2348AIDCNR PARAMETRIC INFO
OPA2348AIDCNR PACKAGE INFO
OPA2348AIDCNR MANUFACTURING INFO
OPA2348AIDCNR PACKAGING INFO
OPA2348AIDCNR EACD MODELS
OPA2348AIDCNR APPLICATIONS


COUNTRY OF ORIGIN
Philippines
Thailand



PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
type Low Power Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.5
Number of Channels per Chip 2
Process Technology CMOS
Minimum PSRR (dB) 84.44(Typ)
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Maximum Quiescent Current (mA) 0.13@5.5V
Typical Gain Bandwidth Product (MHz) 1
Maximum Input Offset Voltage (mV) 5@5V
Maximum Input Offset Current (uA) 0.00001@5.5V
Maximum Operating Supply Voltage (V) 5.5
Maximum Input Bias Current (uA) 0.00001@5.5V
Minimum CMRR (dB) 60
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 60 to 65
Typical Voltage Gain (dB) 108
Typical Slew Rate (V/us) 0.5@5.5V
Typical Settling Time (ns) 7000
Typical Input Noise Voltage Density (nV/rtHz) 35@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.004@5.5V
Typical Input Bias Current (uA) 0.0000005@5.5V
Shut Down Support no
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Rating Extended
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Input Offset Voltage Drift (uV/°C) 4


PACKAGE INFO
Supplier packaging SOT-23
Basic package type Lead-Frame SMT
Number of pins 8
Pin shape Gull-wing
PCB 8
ears N/R
Pin spacing (mm) 0.65
Package length (mm) 3(Max)
Package width (mm) 1.75(Max)
Package height (mm) 1.3(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 3(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Mounting surface height (mm) 1.45(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Small Outline Transistor
Package series name SOT
JEDEC MO-178BA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard J-STD-020D
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Au
Plating materials Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R
Package Tape and reel packaging
Packing quantity 3000
Reel Diameter (in) 7.05
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• Portable Equipment
• Battery-Powered Equipment
• Smoke Alarms
• CO Detectors
• Medical Instrumentation
Продукт RFQ