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• nanoPOWER:– OPA369: 800nA – OPA2369: 700nA/ch.
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• LOW OFFSET VOLTAGE: 250µV – ZERO-CROSSOVER
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• LOW OFFSET DRIFT: 0.4µV/°C
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• PRECISION:– CMRR: 114dB– PSRR:106dB– AOL: 134dB
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• GAIN-BANDWIDTH PRODUCT: 12kHz |
• SUPPLY VOLTAGE: 1.8V to 5.5V |
• microSIZE PACKAGES – SC70-5, SOT23-5, MSOP-8 |
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CATALOG |
OPA2369AIDGKT COUNTRY OF ORIGIN |
OPA2369AIDGKT PARAMETRIC INFO
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OPA2369AIDGKT PACKAGE INFO
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OPA2369AIDGKT MANUFACTURING INFO
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OPA2369AIDGKT PACKAGING INFO
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OPA2369AIDGKT ECAD MODELS
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OPA2369AIDGKT APPLICATIONS |
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COUNTRY OF ORIGIN |
Malaysia |
Thailand |
Taiwan (Province of China) |
China |
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PARAMETRIC INFO
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Manufacturer Type |
Low Power Amplifier |
type |
Low Power Amplifier |
Rail to Rail |
Rail to Rail Input/Output |
Minimum Single Supply Voltage (V) |
1.8 |
Number of Channels per Chip |
2 |
Minimum PSRR (dB) |
106.02(Typ) |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
5.5 |
Typical Gain Bandwidth Product (MHz) |
0.012 |
Maximum Input Offset Voltage (mV) |
0.75@5.5V |
Maximum Input Offset Current (uA) |
0.00005@5.5V |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Input Bias Current (uA) |
0.00005@5.5V |
Minimum CMRR (dB) |
100 |
Maximum Supply Voltage Range (V) |
5.5 to 6 |
Minimum CMRR Range (dB) |
95 to 105 |
Typical Voltage Gain (dB) |
134 |
Typical Slew Rate (V/us) |
0.005@5.5V |
Typical Input Noise Voltage Density (nV/rtHz) |
290@5.5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.001@5.5V |
Shut Down Support |
no |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Power Supply Type |
Single |
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PACKAGE INFO
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Supplier packaging |
VSSOP |
Basic package type |
Lead-Frame SMT |
Number of pins |
8 |
Pin shape |
Gull-wing |
PCB |
8 |
ears |
N/R |
Pin spacing (mm) |
0.65 |
Package length (mm) |
3.1(Max) |
Package width (mm) |
3.1(Max) |
Package height (mm) |
0.95(Max) |
Package diameter (mm) |
N/R |
Package Overall Length (mm) |
3.1(Max) |
Package Overall Width (mm) |
5.05(Max) |
Package Overall Height (mm) |
1.1(Max) |
Mounting surface height (mm) |
1.1(Max) |
Install |
Surface Mount |
Package weight (g) |
not applicable |
Packaging materials |
Plastic |
package instruction |
Very Thin Shrink Small Outline Package |
Package series name |
SO |
JEDEC |
MO-187AA |
Package outline |
Link to datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
30 |
Number of reflow cycles |
3 |
standard |
J-STD-020D |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Lead Finish(Plating) |
Au|AuAg |
Plating materials |
Pd over Ni |
Terminal Base Material |
N/A|Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
T |
Package |
Tape and reel packaging |
Packing quantity |
250 |
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ECAD MODELS
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APPLICATIONS
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• BATTERY-POWERED INSTRUMENTS
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• PORTABLE DEVICES |
• MEDICAL INSTRUMENTS |
• TEST EQUIPMENT
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• LOW-POWER SENSOR SIGNAL CONDITIONING |
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