OPA237NA/250 Texas Instruments SINGLE-SUPPLY OPERATIONAL AMPLIFIERS MicroAmplifier Series

label:
2024/05/16 221

• MICRO-SIZE, MINIATURE PACKAGES:− Single: SOT23-5, SO-8− Dual: MSOP-8, SO-8− Quad: SSOP-16 (Obsolete)
• LOW OFFSET VOLTAGE: 750µV max
• WIDE SUPPLY RANGE:− Single Supply: +2.7V to +36V− Dual Supply: 1.35V to 18V
• LOW QUIESCENT CURRENT: 350µV max
• WIDE BANDWIDTH: 1.5MHz
CATALOG
OPA237NA/250 COUNTRY OF ORIGIN
OPA237NA/250 PARAMETRIC INFO
OPA237NA/250 PACKAGE INFO
OPA237NA/250 MANUFACTURING INFO
OPA237NA/250 PACKAGING INFO
OPA237NA/250 EACD MODELS
OPA237NA/250 APPLICATIONS

 
COUNTRY OF ORIGIN
China
Philippines
PARAMETRIC INFO
Manufacturer Type General Purpose Amplifier
Type General Purpose Amplifier
Minimum Single Supply Voltage (V) 2.7
Number of Channels per Chip 1
Minimum PSRR (dB) 100(Typ)
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 36
Minimum Dual Supply Voltage (V) ±1.35
Typical Gain Bandwidth Product (MHz) 1.4
Maximum Input Offset Voltage (mV) 0.75@5V
Typical Dual Supply Voltage (V) ±15
Maximum Input Offset Current (uA) 0.01@5V
Maximum Dual Supply Voltage (V) ±18
Maximum Operating Supply Voltage (V) ±18|36
Maximum Input Bias Current (uA) 0.04@5V
Minimum CMRR (dB) 78
Maximum Supply Voltage Range (V) 36 to 37
Minimum CMRR Range (dB) 75 to 80
Typical Voltage Gain (dB) 88
Typical Slew Rate (V/us) 0.5@5V
Typical Settling Time (ns) 16000
Typical Input Noise Voltage Density (nV/rtHz) 28@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.06@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 70
Power Supply Type Single|Dual



PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Suffix 250
Packaging Tape and Reel
Quantity Of Packaging 250
Reel Diameter (in) 7
Reel Width (mm) 9
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet



ECAD MODELS

APPLICATIONS
• BATTERY-POWERED INSTRUMENTS
• PORTABLE DEVICES
• PCMCIA CARDS
• MEDICAL INSTRUMENTS
• TEST EQUIPMENT
Продукт RFQ