OPA2727AIDR Texas Instruments IC OPAMP GP 20MHZ RRO 8SOIC

label:
2024/08/6 205
OPA2727AIDR Texas Instruments 	IC OPAMP GP 20MHZ RRO 8SOIC


• OFFSET: 15µV (typ), 150µV (max)
• DRIFT: 0.3µV/°C (typ), 1.5µV/°C (max)
• BANDWIDTH: 20MHz
• SLEW RATE: 30V/µs
• BIAS CURRENT: 500pA (max)


CATALOG
OPA2727AIDR COUNTRY OF ORIGIN
OPA2727AIDR PARAMETRIC INFO
OPA2727AIDR PACKAGE INFO
OPA2727AIDR MANUFACTURING INFO
OPA2727AIDR PACKAGING INFO
OPA2727AIDR ECAD MODELS
OPA2727AIDR APPLICATIONS


COUNTRY OF ORIGIN
Mexico
China
Malaysia


PARAMETRIC INFO
Manufacturer Type Low Offset Voltage Amplifier
Type Low Offset Voltage Amplifier
Minimum Single Supply Voltage (V) 4
Number of Channels per Chip 2
Process Technology CMOS
Minimum PSRR (dB) 90.46(Typ)
Typical Single Supply Voltage (V) 5|9
Maximum Single Supply Voltage (V) 12
Output Type CMOS
Maximum Quiescent Current (mA) 13@12V
Minimum Dual Supply Voltage (V) ±2
Typical Gain Bandwidth Product (MHz) 20
Maximum Input Offset Voltage (mV) 0.15@±5V
Typical Dual Supply Voltage (V) ±3|±5
Maximum Input Offset Current (uA) 0.0001@12V
Maximum Dual Supply Voltage (V) ±6
Maximum Operating Supply Voltage (V) ±6|12
Maximum Input Bias Current (uA) 0.0005@12V
Minimum CMRR (dB) 86
Maximum Supply Voltage Range (V) 12 to 12.5
Minimum CMRR Range (dB) 85 to 90
Typical Voltage Gain (dB) 120
Typical Slew Rate (V/us) 30@12V
Typical Settling Time (ns) 450
Typical Output Current (mA) 40@12V
Typical Input Noise Voltage Density (nV/rtHz) 10@±6V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0025@±6V
Typical Input Bias Current (uA) 0.000085@12V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
Typical Output Resistance (Ohm) 40
Input Offset Voltage Drift (uV/°C) 3


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• OPTICAL NETWORKING
• TRANSIMPEDANCE AMPLIFIERS
• INTEGRATORS
• ACTIVE FILTERS
• A/D CONVERTER DRIVERS
• I/V CONVERTER FOR DACs
• HIGH PERFORMANCE AUDIO
• PROCESS CONTROL
• PROCESS CONTROLT

Продукт RFQ