OPA322AIDBVR Texas Instruments IC OPAMP GP 20MHZ RRO SOT23-5

label:
2023/08/18 404



CATALOG
OPA322AIDBVR COUNTRY OF ORIGIN
OPA322AIDBVR PARAMETRIC INFO
OPA322AIDBVR PACKAGE INFO
OPA322AIDBVR MANUFACTURING INFO
OPA322AIDBVR PACKAGING INFO
OPA322AIDBVR ECAD MODELS


COUNTRY OF ORIGIN
China
Thailand


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 1.8
Number of Channels per Chip 1
Process Technology CMOS
Minimum PSRR (dB) 100(Typ)
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Minimum Dual Supply Voltage (V) ±0.9
Typical Gain Bandwidth Product (MHz) 20
Maximum Input Offset Voltage (mV) 2@5.5V
Maximum Input Offset Current (uA) 0.00001@5.5V
Maximum Dual Supply Voltage (V) ±2.75
Maximum Operating Supply Voltage (V) ±2.75|5.5
Maximum Input Bias Current (uA) 0.00001@5.5V
Minimum CMRR (dB) 90
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 90 to 95
Typical Voltage Gain (dB) 130
Typical Slew Rate (V/us) 10@5.5V
Typical Settling Time (ns) 320
Typical Input Noise Voltage Density (nV/rtHz) 8.5@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0006@5.5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet


ECAD MODELS

Продукт RFQ