OPA333AQDBVRQ1 Texas Instruments IC OPAMP CHOPPER 350KHZ SOT23-5

label:
2023/12/1 335


• AEC-Q100 qualified for automotive applications:
   – Temperature grade 1: –40°C to +125°C, TA
• Low offset voltage: 10 μV (maximum)  
• 0.01-Hz to 10-Hz noise: 1.1 μVPP
• Quiescent current: 17 μA
• Single-supply operation
• Supply voltage: 1.8 V to 5.5 V
• Rail-to-rail input and output
• Microsize 5-pin SOT-23 (DBV) package


CATALOG
OPA333AQDBVRQ1 COUNTRY OF ORIGIN
OPA333AQDBVRQ1 PARAMETRIC INFO
OPA333AQDBVRQ1 PACKAGE INFO
OPA333AQDBVRQ1 MANUFACTURING INFO
OPA333AQDBVRQ1 PACKAGING INFO
OPA333AQDBVRQ1 ECAD MODELS  
OPA333AQDBVRQ1 FUNCTIONAL BLOCK DIAGRAM
OPA333AQDBVRQ1 APPLICATIONS  


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Manufacturer Type Micropower Amplifier
Type Micropower Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 1.8
Number of Channels per Chip 1
Process Technology CMOS
Minimum PSRR (dB) 120(Typ)
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Maximum Quiescent Current (mA) 0.025@5.5V
Minimum Dual Supply Voltage (V) ±0.9
Typical Gain Bandwidth Product (MHz) 0.35
Maximum Input Offset Voltage (mV) 0.01@5V
Maximum Input Offset Current (uA) 0.0004@5V
Maximum Dual Supply Voltage (V) ±2.75
Maximum Operating Supply Voltage (V) ±2.75|5.5
Maximum Input Bias Current (uA) 0.0002@5V
Minimum CMRR (dB) 106
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 105 to 115
Typical Voltage Gain (dB) 130
Typical Slew Rate (V/us) 0.16@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.1@5.5V
Typical Input Bias Current (uA) 0.00007@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Automotive
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
 
PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet
 
ECAD MODELS  


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Pump
• Position sensor
• Vehicle occupant detection sensor
• Brake system  
• Airbag  


Продукт RFQ