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• AEC-Q100 qualified for automotive applications:
– Temperature grade 1: –40°C to +125°C, TA |
• Low offset voltage: 10 μV (maximum)
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• 0.01-Hz to 10-Hz noise: 1.1 μVPP |
• Quiescent current: 17 μA |
• Single-supply operation |
• Supply voltage: 1.8 V to 5.5 V |
• Rail-to-rail input and output |
• Microsize 5-pin SOT-23 (DBV) package |
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CATALOG |
OPA333AQDBVRQ1 COUNTRY OF ORIGIN |
OPA333AQDBVRQ1 PARAMETRIC INFO |
OPA333AQDBVRQ1 PACKAGE INFO |
OPA333AQDBVRQ1 MANUFACTURING INFO |
OPA333AQDBVRQ1 PACKAGING INFO |
OPA333AQDBVRQ1 ECAD MODELS |
OPA333AQDBVRQ1 FUNCTIONAL BLOCK DIAGRAM |
OPA333AQDBVRQ1 APPLICATIONS
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COUNTRY OF ORIGIN |
Thailand |
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PARAMETRIC INFO |
Manufacturer Type |
Micropower Amplifier |
Type |
Micropower Amplifier |
Rail to Rail |
Rail to Rail Input/Output |
Minimum Single Supply Voltage (V) |
1.8 |
Number of Channels per Chip |
1 |
Process Technology |
CMOS |
Minimum PSRR (dB) |
120(Typ) |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
5.5 |
Output Type |
CMOS |
Maximum Quiescent Current (mA) |
0.025@5.5V |
Minimum Dual Supply Voltage (V) |
±0.9 |
Typical Gain Bandwidth Product (MHz) |
0.35 |
Maximum Input Offset Voltage (mV) |
0.01@5V |
Maximum Input Offset Current (uA) |
0.0004@5V |
Maximum Dual Supply Voltage (V) |
±2.75 |
Maximum Operating Supply Voltage (V) |
±2.75|5.5 |
Maximum Input Bias Current (uA) |
0.0002@5V |
Minimum CMRR (dB) |
106 |
Maximum Supply Voltage Range (V) |
5.5 to 6 |
Minimum CMRR Range (dB) |
105 to 115 |
Typical Voltage Gain (dB) |
130 |
Typical Slew Rate (V/us) |
0.16@5.5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.1@5.5V |
Typical Input Bias Current (uA) |
0.00007@5V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Automotive |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Single|Dual |
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PACKAGE INFO |
Supplier Package |
SOT-23 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
5 |
Lead Shape |
Gull-wing |
PCB |
5 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
3.05(Max) |
Package Width (mm) |
1.75(Max) |
Package Height (mm) |
1.1 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.05(Max) |
Package Overall Width (mm) |
3(Max) |
Package Overall Height (mm) |
1.45(Max) |
Seated Plane Height (mm) |
1.45(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MO-178AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Pump |
• Position sensor |
• Vehicle occupant detection sensor |
• Brake system
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• Airbag
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