 |
|
| ● UNITY-GAIN BANDWIDTH: 450MHz |
| ● WIDE BANDWIDTH: 200MHz GBW |
| ● HIGH SLEW RATE: 360V/µs |
| ● LOW NOISE: 5.8nV/√Hz |
● EXCELLENT VIDEO PERFORMANCE:
- DIFF GAIN: 0.02%, DIFF PHASE:
- 0.05°
0.1dB GAIN FLATNESS: 75MHz |
| ● INPUT RANGE INCLUDES GROUND |
| ● RAIL-TO-RAIL OUTPUT (within 100mV) |
| ● LOW INPUT BIAS CURRENT: 3pA |
| ● THERMAL SHUTDOWN |
| ● SINGLE-SUPPLY OPERATING RANGE: 2.5V to 5.5V |
| ● MicroSIZE PACKAGES |
|
| CATALOG |
| OPA356AIDBVT COUNTRY OF ORIGIN |
| OPA356AIDBVT PARAMETRIC INFO |
| OPA356AIDBVT PACKAGE INFO |
| OPA356AIDBVT MANUFACTURING INFO |
| OPA356AIDBVT ECAD MODELS |
| OPA356AIDBVT APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| Thailand |
| China |
| Philippines |
|
| PARAMETRIC INFO |
| Manufacturer Type |
High Speed Amplifier |
| Type |
High Speed Amplifier |
| Rail to Rail |
Rail to Rail Output |
| Minimum Single Supply Voltage (V) |
2.5 |
| Number of Channels per Chip |
1 |
| Process Technology |
CMOS |
| Minimum PSRR (dB) |
81.94(Typ) |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Output Type |
CMOS |
| Minimum Dual Supply Voltage (V) |
±1.25 |
| Typical Gain Bandwidth Product (MHz) |
200 |
| Maximum Input Offset Voltage (mV) |
9@5V |
| Maximum Input Offset Current (uA) |
0.00005@5.5V |
| Maximum Dual Supply Voltage (V) |
±2.75 |
| Maximum Operating Supply Voltage (V) |
±2.75|5.5 |
| Maximum Input Bias Current (uA) |
0.00005@5.5V |
| Minimum CMRR (dB) |
66 |
| Maximum Supply Voltage Range (V) |
5.5 to 6 |
| Minimum CMRR Range (dB) |
65 to 70 |
| Typical Voltage Gain (dB) |
92 |
| Typical Slew Rate (V/us) |
360@5.5V |
| Typical Settling Time (ns) |
120 |
| Typical Output Current (mA) |
60(Min)@5.5V |
| Typical Input Noise Voltage Density (nV/rtHz) |
5.8@5.5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.05@5.5V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single|Dual |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| ● VIDEO PROCESSING |
| ● ULTRASOUND |
| ● OPTICAL NETWORKING, TUNABLE LASERS |
| ● PHOTODIODE TRANSIMPEDANCE AMPS |
| ● ACTIVE FILTERS |
| ● HIGH-SPEED INTEGRATORS |
| ● ANALOG-TO-DIGITAL (A/D) CONVERTER
INPUT BUFFERS |
| ● DIGITAL-TO-ANALOG (D/A) CONVERTER
OUTPUT AMPLIFIERS |
| ● BARCODE SCANNERS |
| ● COMMUNICATIONS |
|
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