OPA365AIDBVR Texas Instruments IC OPAMP GP 50MHZ RRO SOT23-5

label:

2023/12/29 313

• Gain bandwidth: 50 MHz

• Zerø-crossover distortion topology:
– Excellent THD+N: 0.0004%
– CMRR: 100 dB (minimum)
– Rail-to-rail input and output
• Input 100 mV beyond supply rail

• Low noise: 4.5 nV/√Hz at 100 kHz

• Slew rate: 25 V/µs

• Fast settling: 0.3 μs to 0.01%

• Precision:
– Low offset: 100 µV
– Low input bias current: 0.2 pA

• 2.2-V to 5.5-V operation

CATALOG

OPA365AIDBVR COUNTRY OF ORIGIN

OPA365AIDBVR PARAMETRIC INFO

OPA365AIDBVR PACKAGE INFO

OPA365AIDBVR MANUFACTURING INFO

OPA365AIDBVR PACKAGING INFO

OPA365AIDBVR ECAD MODELS

OPA365AIDBVR FUNCTIONAL BLOCK DIAGRAM

OPA365AIDBVR APPLICATIONS

COUNTRY OF ORIGIN

China

Thailand

Philippines

Malaysia

PARAMETRIC INFO

Manufacturer Type	High Speed Amplifier
Type	High Speed Amplifier
Rail to Rail	Rail to Rail Input/Output
Minimum Single Supply Voltage (V)	2.2
Number of Channels per Chip	1
Process Technology	CMOS
Minimum PSRR (dB)	100(Typ)
Typical Single Supply Voltage (V)	3\|5
Maximum Single Supply Voltage (V)	5.5
Output Type	CMOS
Maximum Quiescent Current (mA)	5@5.5V
Minimum Dual Supply Voltage (V)	±1.1
Typical Gain Bandwidth Product (MHz)	50
Maximum Input Offset Voltage (mV)	0.2@5.5V
Maximum Input Offset Current (uA)	0.00001@5.5V
Maximum Dual Supply Voltage (V)	±2.75
Maximum Operating Supply Voltage (V)	±2.75\|5.5
Maximum Input Bias Current (uA)	0.00001@5.5V
Minimum CMRR (dB)	100
Maximum Supply Voltage Range (V)	5.5 to 6
Minimum CMRR Range (dB)	95 to 105
Typical Voltage Gain (dB)	120
Typical Slew Rate (V/us)	25@5.5V
Typical Settling Time (ns)	300
Typical Output Current (mA)	65
Typical Input Noise Voltage Density (nV/rtHz)	4.5@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz)	0.004@5.5V
Typical Input Bias Current (uA)	0.0000002@5.5V
Shut Down Support	No
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Power Supply Type	Single\|Dual
Typical Output Resistance (Ohm)	30
Input Offset Voltage Drift (uV/°C)	1(Typ)

PACKAGE INFO

Supplier Package	SOT-23
Basic Package Type	Lead-Frame SMT
Pin Count	5
Lead Shape	Gull-wing
PCB	5
Tab	N/R
Pin Pitch (mm)	0.95
Package Length (mm)	3.05(Max)
Package Width (mm)	1.75(Max)
Package Height (mm)	1.1
Package Diameter (mm)	N/R
Package Overall Length (mm)	3.05(Max)
Package Overall Width (mm)	3(Max)
Package Overall Height (mm)	1.45(Max)
Seated Plane Height (mm)	1.45(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Small Outline Transistor
Package Family Name	SOT
Jedec	MO-178AA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging Suffix	R
Packaging	Tape and Reel
Quantity Of Packaging	3000
Reel Diameter (in)	7
Reel Width (mm)	9
Tape Pitch (mm)	4
Tape Width (mm)	8
Component Orientation	Q3
Packaging Document	Link to Datasheet

ECAD MODELS

FUNCTIONAL BLOCK DIAGRAM

APPLICATIONS

• Signal conditioning

• Data acquisition

• Process control

• Active filters

• Test equipment

• Audio

• Wideband amplifiers