OPA378AIDCKR Texas Instruments Low-Noise, 900kHz, RRIO, Precision OPERATIONAL AMPLIFIER Zerø-Drift Series

label:
2024/03/18 285



• LOW NOISE
• ZERØ-DRIFT SERIES
• QUIESCENT CURRENT: 125μA
• GAIN BANDWIDTH: 900kHz
• RAIL-TO-RAIL INPUT/OUTPUT
• EMI FILTERING
• SUPPLY VOLTAGE: 2.2V to 5.5V
• microSIZE PACKAGES: SC70 and SOT23


CATALOG
OPA378AIDCKR COUNTRY OF ORIGIN
OPA378AIDCKR PARAMETRIC INFO
OPA378AIDCKR PACKAGE INFO
OPA378AIDCKR MANUFACTURING INFO
OPA378AIDCKR PACKAGING INFO
OPA378AIDCKR EACD MODELS
OPA378AIDCKR APPLICATIONS


COUNTRY OF ORIGIN
Thailand
China


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
type Low Noise Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.2
Number of Channels per Chip 1
Minimum PSRR (dB) 116.48(Typ)
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Typical Gain Bandwidth Product (MHz) 0.9
Maximum Input Offset Voltage (mV) 0.05@5.5V
Maximum Input Offset Current (uA) 0.0011@5.5V
Maximum Operating Supply Voltage (V) 5.5
Maximum Input Bias Current (uA) 0.00055@5.5V
Minimum CMRR (dB) 94
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 90 to 95
Typical Voltage Gain (dB) 134
Typical Slew Rate (V/us) 0.4@5.5V
Typical Settling Time (ns) 9000
Typical Input Noise Voltage Density (nV/rtHz) 20@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.2@5.5V
Shut Down Support no
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Power Supply Type Single


PACKAGE INFO
Supplier packaging SC-70
Basic package type Lead-Frame SMT
Number of pins 5
Pin shape Gull-wing
PCB 5
ears N/R
Pin spacing (mm) 0.65
Package length (mm) 2.15(Max)
Package width (mm) 1.4(Max)
Package height (mm) 0.9
Package diameter (mm) N/R
Package Overall Length (mm) 2.15(Max)
Package Overall Width (mm) 2.4(Max)
Package Overall Height (mm) 1.1(Max)
Mounting surface height (mm) 1.1(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Small Outline Transistor
Package series name SOT
JEDEC MO-203
Package outline Link to datasheet
Maximum PACKAGE_DIMENSION_H 1
Minimum PACKAGE_DIMENSION_H not applicable
Maximum PACKAGE_DIMENSION_L 2.15
Minimum PACKAGE_DIMENSION_L 1.85
Maximum PACKAGE_DIMENSION_W 1.4
Minimum PACKAGE_DIMENSION_W 1.1
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.1


MANUFACTURING INFO
MSL 2
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard J-STD-020D
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) 260
Wave soldering time (seconds) 4
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) Au
Plating materials Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles not applicable


PACKAGING INFO
Packaging Suffix R
Package Tape and reel packaging
Packing quantity 3000
Reel Diameter (in) 7
Reel Width (mm) 8.4|9
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• PORTABLE MEDICAL DEVICES– GLUCOSE METERS– OXYGEN METERING– HEART RATE MONITORS
• WEIGH SCALES
• BATTERY-POWERED INSTRUMENTS
• THERMOPILE MODULES
• HANDHELD TEST EQUIPMENT
• SENSOR SIGNAL CONDITIONING
Продукт RFQ