OPA4192IPWR Texas Instruments OPAx192 36-V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Op Amp with e-trim™

Manufacturer Type	Precision Amplifier
Type	Precision Amplifier
Rail to Rail	Rail to Rail Input/Output
Minimum Single Supply Voltage (V)	4.5
Number of Channels per Chip	4
Minimum PSRR (dB)	120(Typ)
Typical Single Supply Voltage (V)	5\|9\|12\|15\|18\|24\|28
Maximum Single Supply Voltage (V)	36
Maximum Quiescent Current (mA)	4.8@36V
Minimum Dual Supply Voltage (V)	±2.25
Typical Gain Bandwidth Product (MHz)	10
Maximum Input Offset Voltage (mV)	0.04@36V
Typical Dual Supply Voltage (V)	±3\|±5\|±9\|±12\|±15
Maximum Input Offset Current (uA)	0.00002@36V
Maximum Dual Supply Voltage (V)	±18
Maximum Operating Supply Voltage (V)	±18\|36
Maximum Input Bias Current (uA)	0.00002@36V
Minimum CMRR (dB)	100
Maximum Supply Voltage Range (V)	36 to 37
Minimum CMRR Range (dB)	95 to 105
Typical Voltage Gain (dB)	140
Typical Slew Rate (V/us)	20@36V
Typical Settling Time (ns)	2100
Typical Output Current (mA)	65
Typical Input Noise Voltage Density (nV/rtHz)	32@36V
Typical Noninverting Input Current Noise Density (pA/rtHz)	0.0015@36V
Typical Input Bias Current (uA)	0.000005@36V
Shut Down Support	No
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Power Supply Type	Single\|Dual
Input Offset Voltage Drift (uV/°C)	1

Supplier Package	TSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	14
Lead Shape	Gull-wing
PCB	14
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	5.1(Max)
Package Width (mm)	4.5(Max)
Package Height (mm)	1.05(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	5.1(Max)
Package Overall Width (mm)	6.6(Max)
Package Overall Height (mm)	1.2(Max)
Seated Plane Height (mm)	1.2(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-153

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

• Multiplexed Data-Acquisition Systems

• Test and Measurement Equipment

• High-Resolution ADC Driver Amplifiers

• SAR ADC Reference Buffers

• Programmable Logic Controllers

• High-Side and Low-Side Current Sensing

• High Precision Comparator